This patchset adds thermal support for MT8365 SoC.
MT8365 has 4 thermal sensors, one for CPUs and the rest for debug/dev
purposes. The CPU thermal zone uses passive cooling device with
CPU{0..3}.
Changes in v9:
- Use delay between bank init and the thermal zone device register.
- Link to v8: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v8-0-23e8fbb08837@xxxxxxxxxxxx
Signed-off-by: Amjad Ouled-Ameur <aouledameur@xxxxxxxxxxxx>
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Amjad Ouled-Ameur (2):
thermal: mediatek: add callback for raw to mcelsius conversion
thermal: mediatek: add delay after thermal banks initialization
Fabien Parent (2):
dt-bindings: thermal: mediatek: add binding documentation for MT8365 SoC
thermal: mediatek: add support for MT8365 SoC
Markus Schneider-Pargmann (1):
thermal: mediatek: control buffer enablement tweaks
.../bindings/thermal/mediatek-thermal.txt | 1 +
drivers/thermal/mtk_thermal.c | 117 +++++++++++++++++----
2 files changed, 96 insertions(+), 22 deletions(-)
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base-commit: a2c81dc59d41e92362ab7d41d0c15471ea50637d
change-id: 20221018-up-i350-thermal-bringup-ad386d37056f
Best regards,
--
Amjad Ouled-Ameur <aouledameur@xxxxxxxxxxxx>
