On 24/01/2023 23:27, Amjad Ouled-Ameur wrote:
On 1/24/23 18:55, Daniel Lezcano wrote:
On 24/01/2023 18:46, Amjad Ouled-Ameur wrote:
On 1/24/23 17:54, Daniel Lezcano wrote:
Hi Amjad,
On 24/01/2023 11:08, Amjad Ouled-Ameur wrote:
[ ... ]
IIUC, there is a sensor per couple of cores. 1 x 2Bigs, 1 x
2Bigs, 1 x 4 Little, right ?
MT8365 SoC has 4 x A53 CPUs. The SoC has 4 thermal zones per
sensor. Thermal zone 0 corresponds
to all 4 x A53 CPUs, the other thermal zones (1, 2 and 3) has
nothing to do with CPUs. The cooling device type
used for CPUs is passive. FYI, thermal zones 1, 2 and 3 are
present in the SoC for debug-purpose only, they are not supposed
to be used for production.
After reconsidering the fact that zones 1, 2 and 3 are only used
for dev/debug, it might be best to avo >
aggregation as you suggested, and keep only support for zone 0 in
this driver. Thus I suggest I send a V8
where I keep only below fixes for this patch if that's okay with you:
- Define "raw_to_mcelsius" function pointer for "struct
thermal_bank_cfg".
- Fix "mtk_thermal" variable in mtk_read_temp().
- Set "mt->raw_to_mcelsius" in probe().
For zones 1, 2 and 3 we can later add a different driver specific
for dev/debug to probe them to
avoid confusion.
You can add them in the driver and in the device tree, but just add
the cooling device for the thermal zone 0.
Thermal zone 0 uses CPU{0..3} for passive cooling, in this case we
should register cooling device with
cpufreq_cooling_register() for each CPU right ?
No, the OF code device tree does already that. You just have to
register the different thermal zones.
Do you have a pointer to a device tree for this board and the thermal
setup ?
Sure, here is a dtsi for MT8365 SoC which contains thermal nodes [0].
From my POV, there are two different setup with the DT but only one
implementation with the driver.
The driver should register all the thermal zones for each CPUs. For
that, make things nice with the defines for the dt-bindings like [1].
Then the device tree:
setup1:
Describe all the thermal zones in the DT which will be similar to [2].
Each CPU has a thermal zone, trip points and the same cooling device.
The first thermal zone reaching the trip temperature threshold will
start the mitigation. The thermal framework takes care of multiple
thermal zones sharing the same cooling device.
The result will be the same as the max temperature aggregation you did
previously.
setup2:
Describe all the thermal zones in the DT [3], but add the cooling device
only on the sensor you are interested in mitigating.
And finally, if the sensors should be used to describe a kind of
temperature gradient, a linear equation could be used but that is not
implemented yet in the thermal framework.
Hope that helps
-- Daniel
[1]
https://lore.kernel.org/linux-arm-kernel/5dd5c795-5e67-146d-7132-30fc90171d4c@xxxxxxxxxxxxx/T/#Z2e.:..:20230124131717.128660-3-bchihi::40baylibre.com:1include:dt-bindings:thermal:mediatek-lvts.h
[2]
https://lore.kernel.org/linux-arm-kernel/5dd5c795-5e67-146d-7132-30fc90171d4c@xxxxxxxxxxxxx/T/#m303240c4da71f6f37831e5d1b6f3da771ae8dd90
[3]
https://lore.kernel.org/linux-arm-kernel/5dd5c795-5e67-146d-7132-30fc90171d4c@xxxxxxxxxxxxx/T/#Z2e.:..:20230124131717.128660-6-bchihi::40baylibre.com:1arch:arm64:boot:dts:mediatek:mt8195.dtsi
--
<http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs
Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog
