This patchset introduces the arm64 dts and defconfig changes for introducing the Qualcomm Cooling Driver (aka Qualcomm Thermal Mitigation Driver). Several Qualcomm Snapdragon SoCs have Thermal Mitigation Devices (TMDs) present on various remote subsystem(s) (for e.g. the Compute DSP, aka cDSP), which can be used for several mitigations for remote subsystem(s), including remote processor mitigation, rail voltage restriction etc. At the very top-level, the dts is supposed to describe a TMD node, which should further represent the remote subsystem(s) present on the SoC and further each child of a subsystem should represent the separate cooling devices available on the remote subsystem. Note that this patchset is targeted for the 'linux-arm-msm' tree and the thermal driver/dtbinding patchset/changes targeted for 'linux-pm' tree has been sent as a separate patchset (see [1]). Note that without the PATCH mentioned in [2] this patchset will not compile cleanly. This patchset is based on the latest 'linux-next/master'. [1]. https://lore.kernel.org/linux-arm-msm/20220912085049.3517140-1-bhupesh.sharma@xxxxxxxxxx/ [2]. https://lore.kernel.org/linux-arm-msm/20220912085049.3517140-4-bhupesh.sharma@xxxxxxxxxx/ Cc: andersson@xxxxxxxxxx Cc: robh@xxxxxxxxxx Cc: daniel.lezcano@xxxxxxxxxx Cc: rafael@xxxxxxxxxx Bhupesh Sharma (3): arm64: dts: qcom: sm8150: Add qmi cooling device nodes arm64: dts: qcom: sa8155p-adp: Enable qmi cooling device arm64: defconfig: Enable Qualcomm QMI cooling device driver arch/arm64/boot/dts/qcom/sa8155p-adp.dts | 4 ++ arch/arm64/boot/dts/qcom/sm8150.dtsi | 62 ++++++++++++++++++++++++ arch/arm64/configs/defconfig | 1 + 3 files changed, 67 insertions(+) -- 2.37.1
