On 4/21/21 11:06 PM, Ezequiel Garcia wrote: > On Wed, 2021-04-21 at 22:46 +0200, Johan Jonker wrote: >> On 4/21/21 10:04 PM, Ezequiel Garcia wrote: >>> Add a new compatible for the thermal sensor device on RK3568 SoCs. >>> >>> Signed-off-by: Ezequiel Garcia <ezequiel@xxxxxxxxxxxxx> >>> --- >>> Documentation/devicetree/bindings/thermal/rockchip-thermal.txt | 1 + >>> 1 file changed, 1 insertion(+) >>> >>> diff --git a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt >>> index 7f94669e9ebe..346e466c2006 100644 >>> --- a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt >>> +++ b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt >>> @@ -9,6 +9,7 @@ Required properties: >>> "rockchip,rk3328-tsadc": found on RK3328 SoCs >>> "rockchip,rk3368-tsadc": found on RK3368 SoCs >>> "rockchip,rk3399-tsadc": found on RK3399 SoCs >> >>> + "rockchip,rk3568-tsadc": found on RK3568 SoCs >> >> This is still a text document. >> rob+dt has now scripts that check for undocumented compatibility >> strings, so first convert rockchip-thermal.txt to YAML and then add this >> in a separated patch. >> > > Is it a showstopper to convert devicetree bindings to YAML for driver submission? You now that hardware best, so try to fix the documents as well. The new norm is YAML, so aim for that. Try to submit a complete package of YAML, driver (and dts nodes) for review. New nodes should not generate more notifications then we already have. Johan > > Thanks, > Ezequiel >
