On Wed, 2021-04-21 at 22:46 +0200, Johan Jonker wrote: > On 4/21/21 10:04 PM, Ezequiel Garcia wrote: > > Add a new compatible for the thermal sensor device on RK3568 SoCs. > > > > Signed-off-by: Ezequiel Garcia <ezequiel@xxxxxxxxxxxxx> > > --- > > Documentation/devicetree/bindings/thermal/rockchip-thermal.txt | 1 + > > 1 file changed, 1 insertion(+) > > > > diff --git a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt > > index 7f94669e9ebe..346e466c2006 100644 > > --- a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt > > +++ b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt > > @@ -9,6 +9,7 @@ Required properties: > > "rockchip,rk3328-tsadc": found on RK3328 SoCs > > "rockchip,rk3368-tsadc": found on RK3368 SoCs > > "rockchip,rk3399-tsadc": found on RK3399 SoCs > > > + "rockchip,rk3568-tsadc": found on RK3568 SoCs > > This is still a text document. > rob+dt has now scripts that check for undocumented compatibility > strings, so first convert rockchip-thermal.txt to YAML and then add this > in a separated patch. > Is it a showstopper to convert devicetree bindings to YAML for driver submission? Thanks, Ezequiel
