From: AngeloGioacchino Del Regno <kholk11@xxxxxxxxx> This patch series adds the SDM660 interconnect provider driver in order to stop some timeouts and achieve some decent performance by avoiding to be NoC limited. It's also providing some power consumption improvement, but I have only measured that as less heat, which is quite important when working on thermally constrained devices like smartphones. Please note that this driver's yaml binding is referring to a MMCC clock, so this series does depend on the SDM660 MMCC driver that I have sent separately. The multimedia clock is required only for the Multimedia NoC (mnoc). This patch series has been tested against the following devices: - Sony Xperia XA2 Ultra (SDM630 Nile Discovery) - Sony Xperia 10 (SDM630 Ganges Kirin) - Sony Xperia 10 Plus (SDM636 Ganges Mermaid) Changes in v2: - Added missing qcom,mmcc-sdm660.h dt-binding include in the interconnect/qcom,sdm660.yaml binding, as pointed out by Rob Herring Changes in v3: - Moved the dt-bindings/interconnect/qcom,sdm660.h header to dt-bindings commit. AngeloGioacchino Del Regno (2): dt-bindings: interconnect: Add bindings for Qualcomm SDM660 NoC interconnect: qcom: Add SDM660 interconnect provider driver .../bindings/interconnect/qcom,sdm660.yaml | 147 +++ drivers/interconnect/qcom/Kconfig | 9 + drivers/interconnect/qcom/Makefile | 2 + drivers/interconnect/qcom/sdm660.c | 919 ++++++++++++++++++ .../dt-bindings/interconnect/qcom,sdm660.h | 116 +++ 5 files changed, 1193 insertions(+) create mode 100644 Documentation/devicetree/bindings/interconnect/qcom,sdm660.yaml create mode 100644 drivers/interconnect/qcom/sdm660.c create mode 100644 include/dt-bindings/interconnect/qcom,sdm660.h -- 2.28.0
