Re: [PATCH] ARM: dts: sun8i-h3: Add thermal trip points/cooling maps

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Subject: Re: [PATCH] ARM: dts: sun8i-h3: Add thermal trip points/cooling maps
From: Chen-Yu Tsai <wens@xxxxxxxx>
Date: Sun, 23 Feb 2020 11:29:31 +0800
Cc: linux-sunxi <linux-sunxi@xxxxxxxxxxxxxxxx>, Rob Herring <robh+dt@xxxxxxxxxx>, Mark Rutland <mark.rutland@xxxxxxx>, Maxime Ripard <mripard@xxxxxxxxxx>, "open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS" <devicetree@xxxxxxxxxxxxxxx>, "moderated list:ARM/Allwinner sunXi SoC support" <linux-arm-kernel@xxxxxxxxxxxxxxxxxxx>, open list <linux-kernel@xxxxxxxxxxxxxxx>
In-reply-to: <20200222214224.209860-1-megous@megous.com>

On Sun, Feb 23, 2020 at 5:42 AM Ondrej Jirman <megous@xxxxxxxxxx> wrote:
>
> This enables passive cooling by down-regulating CPU voltage
> and frequency.

Please state for the record how the trip points were derived. Were they from
the BSP? Or the user manual?

ChenYu

> Signed-off-by: Ondrej Jirman <megous@xxxxxxxxxx>

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  - From: Ondrej Jirman

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