On Fri, Dec 13, 2019 at 6:00 PM Florian Fainelli <f.fainelli@xxxxxxxxx> wrote: > > > > On 12/13/2019 3:50 PM, Rob Herring wrote: > > On Fri, Dec 06, 2019 at 05:09:34PM -0800, Ray Jui wrote: > >> > >> > >> On 12/5/19 4:09 PM, Florian Fainelli wrote: > >>> On 12/2/19 3:31 PM, Ray Jui wrote: > >>>> Add binding document for iProc based IDM devices. > >>>> > >>>> Signed-off-by: Ray Jui <ray.jui@xxxxxxxxxxxx> > >>> > >>> Looks good to me, it's 2019, nearly 2020, maybe make this a YAML > >>> compatible binding since it is a new one? > >>> > >> > >> Sorry I am not aware of this YAML requirement until now. > >> > >> Is this a new requirement that new DT binding document should be made with > >> YAML format? > > > > The format has been in place in the kernel for a year now and we've > > moved slowly towards it being required. If you're paying that little > > attention to upstream, then yes it's definitely required so someone else > > doesn't get stuck converting your binding later. > > > > BTW, I think all but RPi chips still need their SoC/board bindings > > converted. One of the few not yet converted... > > Is there something more to do than what Stefan did here: > > https://git.kernel.org/pub/scm/linux/kernel/git/torvalds/linux.git/commit/?id=ab06837dd269b600396b298e9f4678d02b11b71d No, that's it. > we could convert other Broadcom SoCs, and there, just found another > weekend project! > -- > Florian
