On 12/13/2019 3:50 PM, Rob Herring wrote: > On Fri, Dec 06, 2019 at 05:09:34PM -0800, Ray Jui wrote: >> >> >> On 12/5/19 4:09 PM, Florian Fainelli wrote: >>> On 12/2/19 3:31 PM, Ray Jui wrote: >>>> Add binding document for iProc based IDM devices. >>>> >>>> Signed-off-by: Ray Jui <ray.jui@xxxxxxxxxxxx> >>> >>> Looks good to me, it's 2019, nearly 2020, maybe make this a YAML >>> compatible binding since it is a new one? >>> >> >> Sorry I am not aware of this YAML requirement until now. >> >> Is this a new requirement that new DT binding document should be made with >> YAML format? > > The format has been in place in the kernel for a year now and we've > moved slowly towards it being required. If you're paying that little > attention to upstream, then yes it's definitely required so someone else > doesn't get stuck converting your binding later. > > BTW, I think all but RPi chips still need their SoC/board bindings > converted. One of the few not yet converted... Is there something more to do than what Stefan did here: https://git.kernel.org/pub/scm/linux/kernel/git/torvalds/linux.git/commit/?id=ab06837dd269b600396b298e9f4678d02b11b71d we could convert other Broadcom SoCs, and there, just found another weekend project! -- Florian
