On Sun, Jun 23, 2019 at 9:42 AM Yangtao Li <tiny.windzz@xxxxxxxxx> wrote: > > This patchset add support for H3 and H6 thermal sensor. > > BTY, do a cleanup in thermal makfile. > > Yangtao Li (11): > thermal: sun8i: add thermal driver for h6 > dt-bindings: thermal: add binding document for h6 thermal controller > thermal: fix indentation in makefile > thermal: sun8i: get ths sensor number from device compatible > thermal: sun8i: rework for sun8i_ths_get_temp() > thermal: sun8i: get ths init func from device compatible > thermal: sun8i: rework for ths irq handler func > thermal: sun8i: support ahb clocks > thermal: sun8i: rework for ths calibrate func > dt-bindings: thermal: add binding document for h3 thermal controller > thermal: sun8i: add thermal driver for h3 It would be nice to add dts changes to this series. It's unlikely that you'll get any "Tested-by" otherwise. > .../bindings/thermal/sun8i-thermal.yaml | 94 +++ > MAINTAINERS | 7 + > drivers/thermal/Kconfig | 14 + > drivers/thermal/Makefile | 9 +- > drivers/thermal/sun8i_thermal.c | 534 ++++++++++++++++++ > 5 files changed, 654 insertions(+), 4 deletions(-) > create mode 100644 Documentation/devicetree/bindings/thermal/sun8i-thermal.yaml > create mode 100644 drivers/thermal/sun8i_thermal.c > > --- > v4: > -add h3 support > -fix yaml file > --- > 2.17.1 > > > _______________________________________________ > linux-arm-kernel mailing list > linux-arm-kernel@xxxxxxxxxxxxxxxxxxx > http://lists.infradead.org/mailman/listinfo/linux-arm-kernel
