On 2017/7/1 11:06, "Eduardo Valentin" <edubezval@xxxxxxxxx> wrote:> > Hey Tao, > > On Thu, Jun 22, 2017 at 11:42:02AM +0800, Tao Wang wrote: > > This patch adds the support for thermal sensor of Hi3660 SoC. > > this will register sensors for thermal framework and use device > > tree to bind cooling device. > > > > Signed-off-by: Tao Wang <kevin.wangtao@xxxxxxxxxxxxx> > > Signed-off-by: Leo Yan <leo.yan@xxxxxxxxxx> > > --- > > Changes in v2: > > - correct alphabet order > > - correct compatible name > > > > drivers/thermal/Kconfig | 10 ++ > > drivers/thermal/Makefile | 1 + > > drivers/thermal/hi3660_thermal.c | 198 > ++++++++++++++++++++++++++++++++++++++ > > 3 files changed, 209 insertions(+) > > create mode 100644 drivers/thermal/hi3660_thermal.c > > > > diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig > > index b5b5fac..ed22a90 100644 > > --- a/drivers/thermal/Kconfig > > +++ b/drivers/thermal/Kconfig > > @@ -192,6 +192,16 @@ config THERMAL_EMULATION > > because userland can easily disable the thermal policy by simply > > flooding this sysfs node with low temperature values. > > > > +config HI3660_THERMAL > > + tristate "Hi3660 thermal driver" > > + depends on ARCH_HISI || COMPILE_TEST > > + depends on HAS_IOMEM > > + depends on OF > > + default y > > + help > > + Enable this to plug Hi3660 thermal driver into the Linux thermal > > + framework. > > + > > config HISI_THERMAL > > tristate "Hisilicon thermal driver" > > depends on ARCH_HISI || COMPILE_TEST > > diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile > > index 094d703..f29d0a5 100644 > > --- a/drivers/thermal/Makefile > > +++ b/drivers/thermal/Makefile > > @@ -55,6 +55,7 @@ obj-$(CONFIG_INTEL_PCH_THERMAL) += > intel_pch_thermal.o > > obj-$(CONFIG_ST_THERMAL) += st/ > > obj-$(CONFIG_QCOM_TSENS) += qcom/ > > obj-$(CONFIG_TEGRA_SOCTHERM) += tegra/ > > +obj-$(CONFIG_HI3660_THERMAL) += hi3660_thermal.o > > obj-$(CONFIG_HISI_THERMAL) += hisi_thermal.o > > obj-$(CONFIG_MTK_THERMAL) += mtk_thermal.o > > obj-$(CONFIG_GENERIC_ADC_THERMAL) += thermal-generic-adc.o > > diff --git a/drivers/thermal/hi3660_thermal.c > b/drivers/thermal/hi3660_thermal.c > > new file mode 100644 > > index 0000000..68fa9018 > > --- /dev/null > > +++ b/drivers/thermal/hi3660_thermal.c > > @@ -0,0 +1,198 @@ > > +/* > > + * linux/drivers/thermal/hi3660_thermal.c > > + * > > + * Copyright (c) 2017 Hisilicon Limited. > > + * Copyright (c) 2017 Linaro Limited. > > + * > > + * Author: Tao Wang <kevin.wangtao@xxxxxxxxxxxxx> > > + * Author: Leo Yan <leo.yan@xxxxxxxxxx> > > + * > > + * This program is free software; you can redistribute it and/or modify > > + * it under the terms of the GNU General Public License as published by > > + * the Free Software Foundation; version 2 of the License. > > + * > > + * This program is distributed in the hope that it will be useful, > > + * but WITHOUT ANY WARRANTY; without even the implied warranty of > > + * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the > > + * GNU General Public License for more details. > > + * > > + * You should have received a copy of the GNU General Public License > > + * along with this program. If not, see <http://www.gnu.org/licenses/>. > > + */ > > + > > +#include <linux/clk.h> > > +#include <linux/device.h> > > +#include <linux/err.h> > > +#include <linux/io.h> > > +#include <linux/kernel.h> > > +#include <linux/of.h> > > +#include <linux/module.h> > > +#include <linux/platform_device.h> > > +#include <linux/thermal.h> > > + > > +#include "thermal_core.h" > > + > > +#define HW_MAX_SENSORS 4 > > +#define HISI_MAX_SENSORS 6 > > +#define SENSOR_MAX 4 > > +#define SENSOR_AVG 5 > > + > > +#define ADC_MIN 116 > > +#define ADC_MAX 922 > > + > > +/* hi3660 Thermal Sensor Dev Structure */ > > +struct hi3660_thermal_sensor { > > + struct hi3660_thermal_data *thermal; > > + struct thermal_zone_device *tzd; > > + > > + uint32_t id; > > +}; > > + > > +struct hi3660_thermal_data { > > + struct platform_device *pdev; > > + struct hi3660_thermal_sensor sensors[HISI_MAX_SENSORS]; > > + void __iomem *thermal_base; > > +}; > > + > > +unsigned int sensor_reg_offset[HW_MAX_SENSORS] = { 0x1c, 0x5c, 0x9c, > 0xdc }; > > + > > + > > +static int hi3660_thermal_get_temp(void *_sensor, int *temp) > > +{ > > + struct hi3660_thermal_sensor *sensor = _sensor; > > + struct hi3660_thermal_data *data = sensor->thermal; > > + unsigned int idx; > > + int val, average = 0, max = 0; > > + > > + if (sensor->id < HW_MAX_SENSORS) { > > + val = readl(data->thermal_base + sensor_reg_offset[sensor- > >id]); > > + val = clamp_val(val, ADC_MIN, ADC_MAX); > > + } else { > > + for (idx = 0; idx < HW_MAX_SENSORS; idx++) { > > + val = readl(data->thermal_base > > + + sensor_reg_offset[idx]); > > + val = clamp_val(val, ADC_MIN, ADC_MAX); > > + average += val; > > + if (val > max) > > + max = val; > > + } > > + > > + if (sensor->id == SENSOR_MAX) > > + val = max; > > + else if (sensor->id == SENSOR_AVG) > > + val = average / HW_MAX_SENSORS; > > + } > > + > > + *temp = ((val - ADC_MIN) * 165000) / (ADC_MAX - ADC_MIN) - > 40000; > > Where do these constants come from (165000 and 40000) can these some The sensor's temperature range is -40 to 125, that's the source of the constants. > how > be rearranged and described in DT (coefficients) and using the offset and > slope fields? That make sense, I will reconsider about it. > > > + > > + return 0; > > +} > > + > > +static struct thermal_zone_of_device_ops hi3660_of_thermal_ops = { > > + .get_temp = hi3660_thermal_get_temp, > > +}; > > + > > +static int hi3660_thermal_register_sensor(struct platform_device *pdev, > > + struct hi3660_thermal_data *data, > > + struct hi3660_thermal_sensor *sensor, > > + int index) > > +{ > > + int ret = 0; > > + > > + sensor->id = index; > > + sensor->thermal = data; > > + > > + sensor->tzd = devm_thermal_zone_of_sensor_register(&pdev- > >dev, > > + sensor->id, sensor, > &hi3660_of_thermal_ops); > > + if (IS_ERR(sensor->tzd)) { > > + ret = PTR_ERR(sensor->tzd); > > + sensor->tzd = NULL; > > + } > > + > > + return ret; > > +} > > + > > +static void hi3660_thermal_toggle_sensor(struct hi3660_thermal_sensor > *sensor, > > + bool on) > > +{ > > + struct thermal_zone_device *tzd = sensor->tzd; > > + > > + tzd->ops->set_mode(tzd, > > + on ? THERMAL_DEVICE_ENABLED : > THERMAL_DEVICE_DISABLED); > > +} > > + > > +static int hi3660_thermal_probe(struct platform_device *pdev) > > +{ > > + struct device *dev = &pdev->dev; > > + struct hi3660_thermal_data *data; > > + struct resource *res; > > + int ret = 0; > > + int i; > > + > > + data = devm_kzalloc(dev, sizeof(*data), GFP_KERNEL); > > + if (!data) > > + return -ENOMEM; > > + > > + data->pdev = pdev; > > + res = platform_get_resource(pdev, IORESOURCE_MEM, 0); > > + data->thermal_base = devm_ioremap_resource(dev, res); > > + if (IS_ERR(data->thermal_base)) { > > + dev_err(dev, "failed get reg base\n"); > > + return -ENOMEM; > > + } > > + > > + platform_set_drvdata(pdev, data); > > + > > + for (i = 0; i < HISI_MAX_SENSORS; ++i) { > > + ret = hi3660_thermal_register_sensor(pdev, data, > > + &data->sensors[i], i); > > + if (ret) > > + dev_err(&pdev->dev, > > + "failed to register thermal sensor%d: %d\n", > > + i, ret); > > Do you really want to continue if some of the sensors fail to register? Yes, because currently we only use one of these sensors, the others will register fail > > > + else > > + hi3660_thermal_toggle_sensor(&data->sensors[i], > true); > > + } > > + > > + dev_info(&pdev->dev, "Thermal Sensor Loaded\n"); > > Do you really need the above info in the kernel log? That should be unnecessary, I will remove it. > > > + return 0; > > +} > > + > > +static int hi3660_thermal_exit(struct platform_device *pdev) > > +{ > > + struct hi3660_thermal_data *data = platform_get_drvdata(pdev); > > + int i; > > + > > + for (i = 0; i < HISI_MAX_SENSORS; i++) { > > + struct hi3660_thermal_sensor *sensor = &data->sensors[i]; > > + > > + if (!sensor->tzd) > > + continue; > > Why are you considering a valid case of not registering all expected > sensors? Because currently we only use one of these sensors. > > + > > + hi3660_thermal_toggle_sensor(sensor, false); > > + } > > + > > + return 0; > > +} > > + > > +static const struct of_device_id hi3660_thermal_id_table[] = { > > + { .compatible = "hisilicon,hi3660-thermal" }, > > + {} > > +}; > > +MODULE_DEVICE_TABLE(of, hi3660_thermal_id_table); > > + > > +static struct platform_driver hi3660_thermal_driver = { > > + .probe = hi3660_thermal_probe, > > + .remove = hi3660_thermal_exit, > > + .driver = { > > + .name = "hi3660_thermal", > > + .of_match_table = hi3660_thermal_id_table, > > + }, > > +}; > > + > > +module_platform_driver(hi3660_thermal_driver); > > + > > +MODULE_AUTHOR("Tao Wang <kevin.wangtao@xxxxxxxxxxxxx>"); > > +MODULE_AUTHOR("Leo Yan <leo.yan@xxxxxxxxxx>"); > > +MODULE_DESCRIPTION("hi3660 thermal driver"); > > +MODULE_LICENSE("GPL v2"); > > -- > > 1.7.9.5 > > ��.n��������+%������w��{.n����z�{��ܨ}���Ơz�j:+v�����w����ޙ��&�)ߡ�a����z�ޗ���ݢj��w�f
