Re: [PATCH v3 0/4] thermal: hisilicon: enable power allocator for Hi6220

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Hi Leo,

On 30/03/2016 03:53, Leo Yan wrote:
> On Tue, Mar 29, 2016 at 08:45:59AM -0700, Eduardo Valentin wrote:
>> On Tue, Mar 29, 2016 at 07:27:11PM +0800, Leo Yan wrote:
>>> Hi6220 has octa-core so it has quite high power consumption when run
>>> benchmark and introduces high temperature for SoC. So need enable
>>> thermal governor to control temperature and also cannot hurt much for
>>> performance after impose cooling operations on CPU.
>>>
>>> This patch series is to enable power allocator for Hi6220. Patch 1 is to
>>> change "hysteresis" as optional property for trip points, so when enable
>>> power allocator governor we can ignore this property.
>>>
>>> During profiling also found two issues for thermal sensor's driver. The
>>> power allocator just uses only one sensor, so patch 2 is to fix sensor
>>> driver to let it can initialize driver successfully with only enabling
>>> one sensor; patch 3 is to dismiss warning of IRQ imbalance enabling.
>>>
>>> After profiling on Hikey, the power model has been simplized with only
>>> dynamic coefficient, and now it's convienence to pass it from CPU node.
>>> So patch 4 and 5 bind sensor and pass power model parameters.
>>>
>>> This patch series have been tested on 96boards Hikey.
>>
>> Applied patches 1 and 2 in my fixes branch. Patches 3 and 4 need to go
>> via the hisi platform tree. You may add my
>>
>> Acked-by: Eduardo Valentin <edubezval@xxxxxxxxx>
>>
>> on patches 3 and 4 if you want.
> 
> Thanks, Eduardo.
> 
> Hi Wei,
> 
> Could you help pick up patches 3/4 for enabling thermal in dts?

Applied 3 & 4.
Thanks!

Best Regards,
Wei

> 
> Thanks,
> Leo Yan
> 
> .
> 

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