Hi, It’s possible this isn’t supported, I haven’t been able to find a definitive answer yet on whether this configuration is supported or not. Our switches don’t support MLAG so I’m unable to create an LACP bond between the server to two switches. Regards, James. > On 1 Apr 2020, at 12:41, Robert Sander <r.sander@xxxxxxxxxxxxxxxxxxx> wrote: > > On 01.04.20 08:29, James, GleSYS wrote: > >> The reason I want to create two bonds is to have enp179s0f0 as active for the public network, and enp179s0f1 as active for the cluster network, therefore spreading the traffic across the nics. > > I do not think this will work. AFAIK you cannot create a bonding device > from VLAN interfaces, you have to make it the other way around, create > VLAN interfaces on top of your bonding. > > Why not bond in LACP mode and use both interface in parallel? > > Regards > -- > Robert Sander > Heinlein Support GmbH > Schwedter Str. 8/9b, 10119 Berlin > > https://www.heinlein-support.de > > Tel: 030 / 405051-43 > Fax: 030 / 405051-19 > > Amtsgericht Berlin-Charlottenburg - HRB 93818 B > Geschäftsführer: Peer Heinlein - Sitz: Berlin > > _______________________________________________ > ceph-users mailing list -- ceph-users@xxxxxxx > To unsubscribe send an email to ceph-users-leave@xxxxxxx _______________________________________________ ceph-users mailing list -- ceph-users@xxxxxxx To unsubscribe send an email to ceph-users-leave@xxxxxxx
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