On 01.04.20 08:29, James, GleSYS wrote: > The reason I want to create two bonds is to have enp179s0f0 as active for the public network, and enp179s0f1 as active for the cluster network, therefore spreading the traffic across the nics. I do not think this will work. AFAIK you cannot create a bonding device from VLAN interfaces, you have to make it the other way around, create VLAN interfaces on top of your bonding. Why not bond in LACP mode and use both interface in parallel? Regards -- Robert Sander Heinlein Support GmbH Schwedter Str. 8/9b, 10119 Berlin https://www.heinlein-support.de Tel: 030 / 405051-43 Fax: 030 / 405051-19 Amtsgericht Berlin-Charlottenburg - HRB 93818 B Geschäftsführer: Peer Heinlein - Sitz: Berlin
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