On 05/26/2015 05:17 AM, Tim wrote: > On Mon, 2015-05-25 at 16:21 -0500, g wrote: >> also, is there a thermal pad between cpu and heat sink? there >> should be one because they help thermal transfer. > > Thermal pad - heatsink compound, similar job. I wouldn't expect > both to be present, and I'd expect trying both to be a problem > in itself. if one is good, both are better. ;-) pad and paste tim; https://en.wikipedia.org/wiki/Thermally_conductive_pad plus, see the 2 links shown under "References". good reading. after having read the AMD report, i do believe i will stay with non conducting paste. comment about such is very reasonable. [i like wikipedia. takes me back in thoughts of my early childhood days when i used to spend hours in library reading thru the many electronic books, only much easier. ] -- peace out. If Bill Gates got a dime for every time Windows crashes... ...oh, wait. He does. THAT explains it! in a world with out fences, who needs gates. CentOS GNU/Linux 6.6 tc,hago. g . -- users mailing list users@xxxxxxxxxxxxxxxxxxxxxxx To unsubscribe or change subscription options: https://admin.fedoraproject.org/mailman/listinfo/users Fedora Code of Conduct: http://fedoraproject.org/code-of-conduct Guidelines: http://fedoraproject.org/wiki/Mailing_list_guidelines Have a question? Ask away: http://ask.fedoraproject.org
