NASA Researchers Extend Life of Hot Temperature Electronic Chip

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Sept. 11, 2007

J.D. Harrington 
Headquarters, Washington 
202-358-5241 
j.d.harrington@xxxxxxxx

Katherine K. Martin 
Glenn Research Center, Cleveland 
216-433-2406 
katherine.k.martin@xxxxxxxx

RELEASE: 07-189

NASA RESEARCHERS EXTEND LIFE OF HOT TEMPERATURE ELECTRONIC CHIP

CLEVELAND - NASA researchers have designed and built a new circuit 
chip that can take the heat like never before.

In the past, integrated circuit chips could not withstand more than a 
few hours of high temperatures before degrading or failing. This chip 
exceeded 1,700 hours of continuous operation at 500 degrees Celsius - 
a breakthrough that represents a 100-fold increase in what has 
previously been achieved. The new silicon carbide differential 
amplifier integrated circuit chip may provide benefits to anything 
requiring long-lasting electronic circuits in very hot environments.

Such highly durable integrated circuitry and packaging are being 
developed to enable extremely functional but physically small 
circuitry for hot sections of jet engines. In the future, such 
electronics will enhance sensing and control of the combustion 
process that could lead to improved safety and fuel efficiency as 
well as reduced emissions from jet engines. Similar benefits are also 
possible for automotive engines. Additional potential benefits of 
long-lasting high temperature integrated circuitry extend to oil and 
natural gas well drilling and anything requiring long lasting 
electronic circuits in very hot environments, including robotic 
exploration on the hostile surface environment of Venus. 

"It's really a significant step toward mission-enabling harsh 
environment electronics," said Phil Neudeck, an electronics engineer 
and team lead for this work by the Aeronautics Research Mission 
Directorate at NASA's Glenn Research Center in Cleveland. "This new 
capability can eliminate the additional plumbing, wires, weight and 
other performance penalties required to liquid-cool traditional 
sensors and electronics near the hot combustion chamber, or the need 
to remotely locate them elsewhere where they aren't as effective."

This successful project is a combined effort of the Aviation Safety 
and Fundamental Aeronautics programs under NASA's Aeronautics 
Research Mission Directorate. For more information, visit:

http://www.grc.nasa.gov/WWW/SiC

	
-end-



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