On 26-09-2013 23:13, Eduardo Valentin wrote: > Hello all, > > Here is the continuation of work of representing hardware thermal properties > in device tree infrastructure. The present patch series is the fourth version > of this work. Previous versions were sent as RFCs and can be found here: > V3: Too fast, hit send too early. For those interested, here is the link to V3: https://lkml.org/lkml/2013/9/15/122 > RFCv2: http://lkml.org/lkml/2013/8/23/594 > RFCv1: http://lkml.org/lkml/2013/7/22/319 > > Major difference from V3 is on the parser itself. I have updated the binding > documentation and improved the code accordingly to previous comments mainly > from Mark R. and Joe P. > > The changes on hwmon drivers have been accepted by Guenter, and in this > series I am including his Acked-by, as I didn't change anything on that side. > > I also found a bug while using all involved code built as modules, thus > I have reworked a bit the cooling device registration part. This is why > there are two new patches in this series (patches 02 and 04). > > Tests were done, just like in V3, on TI OMAP4430, OMAP4460, OMAP5430 and DRA7, > although this series is not including the DRA7 part (I will be sending separately). > > Thanks all who have been contributing reviewing this code. > > All best, > > Eduardo Valentin (18): > thermal: allow registering without .get_temp > thermal: core: allow binding via .bind when tzp is present > thermal: introduce device tree parser > thermal: core: introduce thermal_of_cooling_device_register > thermal: cpu_cooling: introduce of_cpufreq_cooling_register > cpufreq: cpufreq-cpu0: add dt node parsing for cooling device > properties > hwmon: lm75: expose to thermal fw via DT nodes > hwmon: tmp102: expose to thermal fw via DT nodes > thermal: ti-soc-thermal: use thermal DT infrastructure > arm: dts: add omap4 CPU thermal data > arm: dts: add omap4430 thermal data > arm: dts: add omap4460 thermal data > arm: dts: add cooling properties on omap4430 cpu node > arm: dts: add cooling properties on omap4460 cpu node > arm: dts: add omap5 GPU thermal data > arm: dts: add omap5 CORE thermal data > arm: dts: add omap5 thermal data > arm: dts: add cooling properties on omap5 cpu node > > .../devicetree/bindings/cpufreq/cpufreq-cpu0.txt | 7 + > .../devicetree/bindings/thermal/thermal.txt | 537 +++++++++++++ > arch/arm/boot/dts/omap4-cpu-thermal.dtsi | 41 + > arch/arm/boot/dts/omap443x.dtsi | 15 +- > arch/arm/boot/dts/omap4460.dtsi | 15 +- > arch/arm/boot/dts/omap5-core-thermal.dtsi | 28 + > arch/arm/boot/dts/omap5-gpu-thermal.dtsi | 28 + > arch/arm/boot/dts/omap5.dtsi | 15 +- > drivers/cpufreq/Kconfig | 2 +- > drivers/cpufreq/cpufreq-cpu0.c | 16 + > drivers/hwmon/lm75.c | 35 +- > drivers/hwmon/tmp102.c | 19 + > drivers/thermal/Kconfig | 14 + > drivers/thermal/Makefile | 1 + > drivers/thermal/cpu_cooling.c | 56 +- > drivers/thermal/of-thermal.c | 845 +++++++++++++++++++++ > drivers/thermal/thermal_core.c | 79 +- > drivers/thermal/thermal_core.h | 9 + > drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 77 +- > include/dt-bindings/thermal/thermal.h | 27 + > include/linux/cpu_cooling.h | 25 + > include/linux/thermal.h | 32 +- > 22 files changed, 1880 insertions(+), 43 deletions(-) > create mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt > create mode 100644 arch/arm/boot/dts/omap4-cpu-thermal.dtsi > create mode 100644 arch/arm/boot/dts/omap5-core-thermal.dtsi > create mode 100644 arch/arm/boot/dts/omap5-gpu-thermal.dtsi > create mode 100644 drivers/thermal/of-thermal.c > create mode 100644 include/dt-bindings/thermal/thermal.h > -- You have got to be excited about what you are doing. (L. Lamport) Eduardo Valentin
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