Hi Andrew/Rui, As discussed with Rui Zhang, I dropped the patch for new trip type THERMAL_TRIP_STATE_INSTANCE and made the necessary state magnagement changes in cpufreq cooling functions. Also I fixed all the review comments suggested by Andrew. If any other changes please let me know. This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * TI OMAP (git://git.linaro.org/people/amitdanielk/linux.git omap4460_thermal) * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) The is a small change in cpufreq cooling registration APIs, so a minor change is needed for OMAP and Freescale platforms. Thanks, Amit Daniel Changes since V3: * Dropped the concept of using new trip type THERMAL_TRIP_STATE_INSTANCE as discussed with Rui Zhang. This requires adding some state management logic in cpufreq cooling implementation. * Many review comments suggested by Andrew Morton * More documentation added in cpufreq cooling codes. Changes since V2: *Added Exynos5 TMU sensor support by enhancing the exynos4 tmu driver. Exynos5 TMU driver was internally developed by SangWook Ju <sw.ju@xxxxxxxxxxx>. *Removed cpuhotplug cooling code in this patchset. *Rebased the patches against 3.4-rc6 kernel. Changes since V1: *Moved the sensor driver to driver/thermal folder from driver/hwmon folder as suggested by Mark Brown and Guenter Roeck *Added notifier support to notify the registered drivers of any cpu cooling action. The driver can modify the default cooling behaviour(eg set different max clip frequency). *The percentage based frequency replaced with absolute clipped frequency. *Some more conditional checks when setting max frequency. *Renamed the new trip type THERMAL_TRIP_STATE_ACTIVE to THERMAL_TRIP_STATE_INSTANCE *Many review comments from R, Durgadoss <durgadoss.r@xxxxxxxxx> and eduardo.valentin@xxxxxx implemented. *Removed cooling stats through debugfs patch *The V1 based can be found here, https://lkml.org/lkml/2012/2/22/123 http://lkml.org/lkml/2012/3/3/32 Changes since RFC: *Changed the cpu cooling registration/unregistration API's to instance based *Changed the STATE_ACTIVE trip type to pass correct instance id *Adding support to restore back the policy->max_freq after doing frequency clipping. *Moved the trip cooling stats from sysfs node to debugfs node as suggested by Greg KH greg@xxxxxxxxx *Incorporated several review comments from eduardo.valentin@xxxxxx *Moved the Temperature sensor driver from driver/hwmon/ to driver/mfd as discussed with Guenter Roeck <guenter.roeck@xxxxxxxxxxxx> and Donggeun Kim <dg77.kim@xxxxxxxxxxx> (https://lkml.org/lkml/2012/1/5/7) *Some changes according to the changes in common cpu cooling APIs *The RFC based patches can be found here, https://lkml.org/lkml/2011/12/13/186 https://lkml.org/lkml/2011/12/21/169 Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This codes is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) . But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a)struct thermal_cooling_device *cpufreq_cooling_register( struct freq_clip_table *tab_ptr, unsigned int tab_size) b)void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. All this patchset is based on Kernel version 3.4-rc6 A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. Amit Daniel Kachhap (5): thermal: Add generic cpufreq cooling implementation hwmon: exynos4: Move thermal sensor driver to driver/thermal directory thermal: exynos5: Add exynos5 thermal sensor driver support thermal: exynos: Register the tmu sensor with the kernel thermal layer ARM: exynos: Add thermal sensor driver platform data support Documentation/hwmon/exynos4_tmu | 81 --- Documentation/thermal/cpu-cooling-api.txt | 60 ++ Documentation/thermal/exynos_thermal | 52 ++ drivers/hwmon/Kconfig | 10 - drivers/hwmon/Makefile | 1 - drivers/hwmon/exynos4_tmu.c | 514 -------------- drivers/thermal/Kconfig | 20 + drivers/thermal/Makefile | 4 +- drivers/thermal/cpu_cooling.c | 483 +++++++++++++ drivers/thermal/exynos_thermal.c | 956 ++++++++++++++++++++++++++ include/linux/cpu_cooling.h | 99 +++ include/linux/platform_data/exynos4_tmu.h | 83 --- include/linux/platform_data/exynos_thermal.h | 100 +++ 13 files changed, 1773 insertions(+), 690 deletions(-) delete mode 100644 Documentation/hwmon/exynos4_tmu create mode 100644 Documentation/thermal/cpu-cooling-api.txt create mode 100644 Documentation/thermal/exynos_thermal delete mode 100644 drivers/hwmon/exynos4_tmu.c create mode 100644 drivers/thermal/cpu_cooling.c create mode 100644 drivers/thermal/exynos_thermal.c create mode 100644 include/linux/cpu_cooling.h delete mode 100644 include/linux/platform_data/exynos4_tmu.h create mode 100644 include/linux/platform_data/exynos_thermal.h _______________________________________________ lm-sensors mailing list lm-sensors@xxxxxxxxxxxxxx http://lists.lm-sensors.org/mailman/listinfo/lm-sensors
