On Tue, 04 Jan 2022 16:26:24 +0900, Hector Martin wrote: > This binding is currently used for SDIO devices, but these chips are > also used as PCIe devices on DT platforms and may be represented in the > DT. Re-use the existing binding and add chip compatibles used by Apple > T2 and M1 platforms (the T2 ones are not known to be used in DT > platforms, but we might as well document them). > > Then, add properties required for firmware selection and calibration on > M1 machines. > > Reviewed-by: Linus Walleij <linus.walleij@xxxxxxxxxx> > Signed-off-by: Hector Martin <marcan@xxxxxxxxx> > --- > .../net/wireless/brcm,bcm4329-fmac.yaml | 37 +++++++++++++++++-- > 1 file changed, 34 insertions(+), 3 deletions(-) > Reviewed-by: Rob Herring <robh@xxxxxxxxxx>
