From: Sergei Shtylyov <sshtylyov@xxxxxxxxxxxxx> It appears that the DA8xx/OMAP-L1x glue layer went into the kernel uncompilable: commit 1960e693ac12ae5fe518309d6a63a44c93fad9e7 (davinci: da8xx/omapl1: add support for the second sysconfig module) has renamed DA8XX_SYSCFG_* macros to DA8XX_SYSCFG0_* and it's been committed before the glue layer... Signed-off-by: Sergei Shtylyov <sshtylyov@xxxxxxxxxxxxx> Signed-off-by: Greg Kroah-Hartman <gregkh@xxxxxxx> --- drivers/usb/host/ohci-da8xx.c | 2 +- 1 files changed, 1 insertions(+), 1 deletions(-) diff --git a/drivers/usb/host/ohci-da8xx.c b/drivers/usb/host/ohci-da8xx.c index 4aa08d3..d22fb4d 100644 --- a/drivers/usb/host/ohci-da8xx.c +++ b/drivers/usb/host/ohci-da8xx.c @@ -23,7 +23,7 @@ #error "This file is DA8xx bus glue. Define CONFIG_ARCH_DAVINCI_DA8XX." #endif -#define CFGCHIP2 DA8XX_SYSCFG_VIRT(DA8XX_CFGCHIP2_REG) +#define CFGCHIP2 DA8XX_SYSCFG0_VIRT(DA8XX_CFGCHIP2_REG) static struct clk *usb11_clk; static struct clk *usb20_clk; -- 1.7.0.4 -- To unsubscribe from this list: send the line "unsubscribe linux-usb" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
