On 17.11.2023 18:36, Johan Hovold wrote: > When reviewing the recently submitted series which reworks the dwc3 qcom > glue implementation [1], I noticed that the driver's tear down handling > is currently broken, something which can lead to memory leaks and > potentially use-after-free issues on probe deferral and on driver > unbind. > > Let's get this sorted before reworking driver. > > Note that the last patch has only been compile tested as I don't have > access to a sdm845 device. > > Johan I'll sound like a broken record, but: is there anyone in the world that is actively benefiting from this failed experiment of using the ACPI tables that were shipped with these SoCs? There are so so so many shortcomings associated with it due to how Windows drivers on these platforms know waaaay too much and largely use ACPI to "bind driver x" and I simply think it doesn't make sense to continue carrying this code forward given little use and no testing. Konrad
