On 17/10/2023 05:11, Bjorn Andersson wrote: > The Qualcomm USB block consists of three intertwined parts, the XHCI, > the DWC3 core and the Qualcomm DWC3 glue. The exsting binding represents > the Qualcomm glue part, with the other two represented as in a child > node. > > Rename the qcom,dwc3 binding, to represent that this is indeed only the > glue part, to make room for a combined binding. > > The large "select" is included to avoid the schema to be selected for > validation with the upcoming flattened binding - which includes > snps,dwc3 in the compatible. > > Signed-off-by: Bjorn Andersson <quic_bjorande@xxxxxxxxxxx> > --- Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@xxxxxxxxxx> Best regards, Krzysztof
