Hi, On 6/17/2021 2:01 PM, Ferry Toth wrote: > Hi > > Op 17-06-2021 om 11:58 schreef Wesley Cheng: >> Changes in V10: >> - Fixed compilation errors in config where OF is not used (error due to >> unknown symbol for of_add_property()). Add of_add_property() stub. >> - Fixed compilation warning for incorrect argument being passed to >> dwc3_mdwidth > This fixes the OOPS I had in V9. I do not see any change in performance > on Merrifield though. I see...thanks Ferry! With your testing, are you writing to the device's internal storage (ie UFS, eMMC, etc...), or did you use a ramdisk as well? If not with a ramdisk, we might want to give that a try to avoid the storage path being the bottleneck. You can use "dd" to create an empty file, and then just use that as the LUN's backing file. echo ramdisk.img > /sys/kernel/config/usb_gadget/g1/functions/mass_storage.0/lun.0/file Thanks Wesley Cheng >> Changes in V9: >> - Fixed incorrect patch in series. Removed changes in DTSI, as >> dwc3-qcom will >> add the property by default from the kernel. >> >> Changes in V8: >> - Rebased to usb-testing >> - Using devm_kzalloc for adding txfifo property in dwc3-qcom >> - Removed DWC3 QCOM ACPI property for enabling the txfifo resize >> >> Changes in V7: >> - Added a new property tx-fifo-max-num for limiting how much fifo >> space the >> resizing logic can allocate for endpoints with large burst >> values. This >> can differ across platforms, and tie in closely with overall >> system latency. >> - Added recommended checks for DWC32. >> - Added changes to set the tx-fifo-resize property from dwc3-qcom by >> default >> instead of modifying the current DTSI files. >> - Added comments on all APIs/variables introduced. >> - Updated the DWC3 YAML to include a better description of the >> tx-fifo-resize >> property and added an entry for tx-fifo-max-num. >> >> Changes in V6: >> - Rebased patches to usb-testing. >> - Renamed to PATCH series instead of RFC. >> - Checking for fs_descriptors instead of ss_descriptors for >> determining the >> endpoint count for a particular configuration. >> - Re-ordered patch series to fix patch dependencies. >> >> Changes in V5: >> - Added check_config() logic, which is used to communicate the >> number of EPs >> used in a particular configuration. Based on this, the DWC3 >> gadget driver >> has the ability to know the maximum number of eps utilized in all >> configs. >> This helps reduce unnecessary allocation to unused eps, and will >> catch fifo >> allocation issues at bind() time. >> - Fixed variable declaration to single line per variable, and >> reverse xmas. >> - Created a helper for fifo clearing, which is used by ep0.c >> >> Changes in V4: >> - Removed struct dwc3* as an argument for dwc3_gadget_resize_tx_fifos() >> - Removed WARN_ON(1) in case we run out of fifo space >> Changes in V3: >> - Removed "Reviewed-by" tags >> - Renamed series back to RFC >> - Modified logic to ensure that fifo_size is reset if we pass the >> minimum >> threshold. Tested with binding multiple FDs requesting 6 FIFOs. >> >> Changes in V2: >> - Modified TXFIFO resizing logic to ensure that each EP is reserved a >> FIFO. >> - Removed dev_dbg() prints and fixed typos from patches >> - Added some more description on the dt-bindings commit message >> >> Currently, there is no functionality to allow for resizing the >> TXFIFOs, and >> relying on the HW default setting for the TXFIFO depth. In most >> cases, the >> HW default is probably sufficient, but for USB compositions that contain >> multiple functions that require EP bursting, the default settings >> might not be enough. Also to note, the current SW will assign an EP to a >> function driver w/o checking to see if the TXFIFO size for that >> particular >> EP is large enough. (this is a problem if there are multiple HW defined >> values for the TXFIFO size) >> >> It is mentioned in the SNPS databook that a minimum of TX FIFO depth = 3 >> is required for an EP that supports bursting. Otherwise, there may be >> frequent occurences of bursts ending. For high bandwidth functions, >> such as data tethering (protocols that support data aggregation), mass >> storage, and media transfer protocol (over FFS), the bMaxBurst value >> can be >> large, and a bigger TXFIFO depth may prove to be beneficial in terms >> of USB >> throughput. (which can be associated to system access latency, >> etc...) It >> allows for a more consistent burst of traffic, w/o any interruptions, as >> data is readily available in the FIFO. >> >> With testing done using the mass storage function driver, the results >> show >> that with a larger TXFIFO depth, the bandwidth increased significantly. >> >> Test Parameters: >> - Platform: Qualcomm SM8150 >> - bMaxBurst = 6 >> - USB req size = 256kB >> - Num of USB reqs = 16 >> - USB Speed = Super-Speed >> - Function Driver: Mass Storage (w/ ramdisk) >> - Test Application: CrystalDiskMark >> >> Results: >> >> TXFIFO Depth = 3 max packets >> >> Test Case | Data Size | AVG tput (in MB/s) >> ------------------------------------------- >> Sequential|1 GB x | >> Read |9 loops | 193.60 >> | | 195.86 >> | | 184.77 >> | | 193.60 >> ------------------------------------------- >> >> TXFIFO Depth = 6 max packets >> >> Test Case | Data Size | AVG tput (in MB/s) >> ------------------------------------------- >> Sequential|1 GB x | >> Read |9 loops | 287.35 >> | | 304.94 >> | | 289.64 >> | | 293.61 >> ------------------------------------------- >> >> Wesley Cheng (6): >> usb: gadget: udc: core: Introduce check_config to verify USB >> configuration >> usb: gadget: configfs: Check USB configuration before adding >> usb: dwc3: Resize TX FIFOs to meet EP bursting requirements >> of: Add stub for of_add_property() >> usb: dwc3: dwc3-qcom: Enable tx-fifo-resize property by default >> dt-bindings: usb: dwc3: Update dwc3 TX fifo properties >> >> .../devicetree/bindings/usb/snps,dwc3.yaml | 15 +- >> drivers/usb/dwc3/core.c | 9 + >> drivers/usb/dwc3/core.h | 15 ++ >> drivers/usb/dwc3/dwc3-qcom.c | 9 + >> drivers/usb/dwc3/ep0.c | 2 + >> drivers/usb/dwc3/gadget.c | 212 >> +++++++++++++++++++++ >> drivers/usb/gadget/configfs.c | 22 +++ >> drivers/usb/gadget/udc/core.c | 25 +++ >> include/linux/of.h | 5 + >> include/linux/usb/gadget.h | 5 + >> 10 files changed, 317 insertions(+), 2 deletions(-) >> -- The Qualcomm Innovation Center, Inc. is a member of the Code Aurora Forum, a Linux Foundation Collaborative Project
