Re: [PATCH] MUSB: DA830/OMAP-L137 glue layer

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On Monday 20 April 2009, Sergei Shtylyov wrote:
> Texas Instruments DA830/OMAP-L137 glue layer for the MUSBMHRDC driver.
> 
> Signed-off-by: Sergei Shtylyov <sshtylyov@xxxxxxxxxxxxx>
> Signed-off-by: Yadviga Grigorieva <yadviga@xxxxxxxxxxxxx>
> 
> ---
> The patch is against the recent DaVinci tree.
> Reposting with proper signoffs...

Still holding off on it until DA830 support is merged.
At that time, after review, it can get into merge queues.

If Kevin can merge da830 for 2.6.31 I think everyone can be
happy.  Right now only dm6446 core updates are headed for
the ARM merge queue.  After they're accepted, I think the
support for other DaVinci family chips can start merging.

- Dave
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