From: Joachim Eastwood <manabian@xxxxxxxxx> Date: Thu, 14 May 2015 12:10:55 +0200 > This patch set aims to convert the current dwmac glue layers into > proper platform drivers as request by Arnd[1]. These changes start > from patch 3 and onwards. > > Overview: > Platform driver functions like probe and remove are exported from > the stmmac platform and then used in subsequent glue later > conversions. The conversion involes adding the platform driver > boiler plate code and adding it to the build system. The last patch > removes the driver from the stmmac platform code thus making it into > a library for common platform driver functions. > > The two first patches adds glue layer for my platform. I chose to > first add old style glue layer and then convert it. The churn this > creates is just 3 lines. > > I would be very nice if people could test this patch set on their > respective platform. My testing has been limited to compiling and > testing on my (LPC18xx) platform. Thanks! > > Next I will look into cleaning up the stmmac platform code. > > [1] http://marc.info/?l=linux-arm-kernel&m=143059524606459&w=2 Series applied, thanks Joachim.
