On 27/05/2024 20:03, Niklas Söderlund wrote: > Hi Conor, > > Thanks for your feedback. > > On 2024-05-27 17:37:21 +0100, Conor Dooley wrote: >> On Mon, May 27, 2024 at 03:18:49PM +0200, Niklas Söderlund wrote: >>> Document support for the VIN module in the Renesas V4M (r8a779h0) SoC. >> >> Which is different from the other devices how? > > Compared to the other Gen4 SoC supported it only supports D-PHY. I will > add this to next version, thanks for spotting it. > >> Should be with the driver: >> https://lore.kernel.org/all/20240527132429.1683547-1-niklas.soderlund+renesas@xxxxxxxxxxxx/ > > As I mentioned in the other thread about the ISPCS bindings, I > intentionally posted the bindings separately to allow parallel > upstreaming of driver and DT users. > > Is it really a bad idea to do it this way? For other work I have done > that involves more complex DT changes then adding a compatible, such as > adding a new device or adding more properties to cover more features > only available in a later version of a device. I always post the DT > parts first as this can spur discussions about the design and only after > they are agreed upon do I post the driver parts that make use of them. Binding goes via driver subsystem, so how exactly do you achieve parallelism here comparing to expected way of submitting (driver+binding)? Best regards, Krzysztof
