Re: [PATCH] dt-bindings: media: renesas,vin: Add binding for V4M

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On 27/05/2024 20:03, Niklas Söderlund wrote:
> Hi Conor,
> 
> Thanks for your feedback.
> 
> On 2024-05-27 17:37:21 +0100, Conor Dooley wrote:
>> On Mon, May 27, 2024 at 03:18:49PM +0200, Niklas Söderlund wrote:
>>> Document support for the VIN module in the Renesas V4M (r8a779h0) SoC.
>>
>> Which is different from the other devices how?
> 
> Compared to the other Gen4 SoC supported it only supports D-PHY. I will 
> add this to next version, thanks for spotting it.
> 
>> Should be with the driver:
>> https://lore.kernel.org/all/20240527132429.1683547-1-niklas.soderlund+renesas@xxxxxxxxxxxx/
> 
> As I mentioned in the other thread about the ISPCS bindings, I 
> intentionally posted the bindings separately to allow parallel 
> upstreaming of driver and DT users.
> 
> Is it really a bad idea to do it this way? For other work I have done 
> that involves more complex DT changes then adding a compatible, such as 
> adding a new device or adding more properties to cover more features 
> only available in a later version of a device. I always post the DT 
> parts first as this can spur discussions about the design and only after 
> they are agreed upon do I post the driver parts that make use of them.

Binding goes via driver subsystem, so how exactly do you achieve
parallelism here comparing to expected way of submitting (driver+binding)?

Best regards,
Krzysztof





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