Re: [PATCH 1/8] [RFC] dt-bindings: renesas: Document R-Car H3 and M3-W SiP DT bindings

[Date Prev][Date Next][Thread Prev][Thread Next][Date Index][Thread Index]

 



On Wed, Apr 19, 2017 at 11:15:44AM +0200, Geert Uytterhoeven wrote:
> Document the SiP ("System-in-Package") versions of the R-Car H3 and M3-W
> SoCs, which contain an R-Car H3 or M3-W SoC, RAM, and HyperFlash.
> 
> Add their compatible values to all boards equipped with R-Car Gen3 SiPs.
> 
> Signed-off-by: Geert Uytterhoeven <geert+renesas@xxxxxxxxx>
> ---
> Questions:
>   - Do we need more compatible values, for different configurations?
>     At least r8j7796 is available with either 2 GiB or 4 GiB of RAM,
>     possibly using RAM parts from different vendors.

Same die, just a different package? If so, I don't think you need a 
different compatible. It's going to be a different board from any 
non-SiP which should be enough to distinguish.

Rob



[Index of Archives]     [Linux Samsung SOC]     [Linux Wireless]     [Linux Kernel]     [ATH6KL]     [Linux Bluetooth]     [Linux Netdev]     [Kernel Newbies]     [IDE]     [Security]     [Git]     [Netfilter]     [Bugtraq]     [Yosemite News]     [MIPS Linux]     [ARM Linux]     [Linux Security]     [Linux RAID]     [Linux ATA RAID]     [Samba]     [Device Mapper]

  Powered by Linux