On 3 February 2012 12:42, Zhang Rui <rui.zhang@xxxxxxxxx> wrote: > Hi, sorry for the late response. > > On 四, 2012-01-19 at 14:47 +0530, Amit Kachhap wrote: >> On 13 December 2011 20:43, Amit Daniel Kachhap <amit.kachhap@xxxxxxxxxx> wrote: >> > PATCH 1) [thermal: Add a new trip type to use cooling device instance number] >> > This patch adds a new trip type THERMAL_TRIP_STATE_ACTIVE which passes >> > cooling device instance number and may be helpful for cpufreq cooling devices >> > to take the correct cooling action. >> > > Sorry, I'm still not quite clear about how this will be used. > Say, processor has P0~P3, then we need to register a thermal zone with > three STATE_ACTIVE trip points, like the picture shown below? > > processor in full speed, i.e. P0 > ---------------------------- > state active trip point 1 > ---------------------------- > processor in P1 > ---------------------------- > state active trip point 2 > ---------------------------- > processor in P2 > ---------------------------- > state active trip point 3 > ---------------------------- > processor in P3 > Thanks for the review. Your representation of the 3 PSTATES and trip points are correct. Also remember the case that we have registered one cpufreq cooling device and binded 3 instance of it with the 3 trip points. So in the current patch set_cur_state will pass the instance id also which will help in moving to the current P state. This same behaviour is achieved through PASSIVE state but it iterates through all the P states. so the current patch avoids the iteration and goes to a single state directly. >> > PATCH 2) [thermal: Add generic cpu cooling implementation] >> > This patch adds generic cpu cooling low level implementation through frequency >> > clipping and cpu hotplug. In future, other cpu related cooling devices may be >> > added here. An ACPI version of this already exists(drivers/acpi/processor_thermal.c). >> > But this will be useful for platforms like ARM using the generic thermal interface >> > along with the generic cpu cooling devices. The cooling device registration API's >> > return cooling device pointers which can be easily binded with the thermal zone >> > trip points. >> > > It seems that we can convert the ACPI processor thermal driver to follow > this generic cpu cooling implementation, right? I am not sure if we can convert the processor thermal driver because it performs other cpu cooling like throttling, idle etc and then ACPI abstraction on top of it. I am thinking of exporting the generic low level cooling implementation like this patch is doing from processor_thermal.c file so that it can be usable with non-acpi interface. What is your opinion about it? Thanks, Amit Daniel > > thanks, > rui >> >> Any comments on these patches? I submitted them quite long back. >> >> Regards, >> Amit D >> >> > >> > Amit Daniel Kachhap (2): >> > thermal: Add a new trip type to use cooling device instance number >> > thermal: Add generic cpu cooling implementation >> > >> > Documentation/thermal/cpu-cooling-api.txt | 52 +++++ >> > Documentation/thermal/sysfs-api.txt | 4 +- >> > drivers/thermal/Kconfig | 11 + >> > drivers/thermal/Makefile | 1 + >> > drivers/thermal/cpu_cooling.c | 302 +++++++++++++++++++++++++++++ >> > drivers/thermal/thermal_sys.c | 27 +++- >> > include/linux/cpu_cooling.h | 45 +++++ >> > include/linux/thermal.h | 1 + >> > 8 files changed, 440 insertions(+), 3 deletions(-) >> > create mode 100644 Documentation/thermal/cpu-cooling-api.txt >> > create mode 100644 drivers/thermal/cpu_cooling.c >> > create mode 100644 include/linux/cpu_cooling.h >> > > > _______________________________________________ linux-pm mailing list linux-pm@xxxxxxxxxxxxxxxxxxxxxxxxxx https://lists.linuxfoundation.org/mailman/listinfo/linux-pm
