On Wed, Aug 28, 2019 at 8:35 PM Tony Lindgren <tony@xxxxxxxxxxx> wrote: > more ti-sysc driver changes for omap variants for v5.4 > > Few changes mostly to deal with sgx SoC glue quirk for omap36xx that > is needed for the related sgx SoC glue dts branch. The other changes > are to simplify sysc_check_one_child() sysc_check_children() to be void > functions, and detect d2d module when debugging is enabled. Pulled into arm/late, thanks! Arnd