Hi, On Thu, May 05, 2016 at 10:04:39AM -0700, Tony Lindgren wrote: > * Bin Liu <b-liu@xxxxxx> [160505 08:04]: > > Hi, > > > > On Thu, Apr 28, 2016 at 10:33:12AM -0700, Tony Lindgren wrote: > > > Looks like at least 2430 glue won't idle reliably with the 200 ms > > > autosuspend delay. This causes deeper idle states being blocked for > > > the whole SoC when disconnecting OTG A cable. > > > > > > Increasing the delay to 500 ms seems to idle both MUSB and the PHY > > > reliably. This is probably because of time needed by the hardware > > > based negotiation between MUSB and the PHY. > > > > Unless we know other glues also have the same issue, this change > > affects other glues, right? Can we just increase it for 2430 only? > > Well it's hard to say with no PM working with other glue layers right > now. I would not be suprised if similar issue exists with other phys Right. > too talking with musb. > > Does the current 200 ms autosuspend timeout relate to anything real > other than what I found out with my measurements? Not sure, I didn't checkk where the 200ms comes from. > > If there's no other data available for the 200 ms timeout, I suggest > we just set it to 500 ms and add comments there that at least 2430 > glue needs that. If things are not idling properly for the whole > SoC because musb, the power consumption will be way worse than any > power savings between 200 and 500 ms :) Yeah, make sense. > > BTW, I noticed 300 ms did not make a difference there, and 500 ms > seems to work so far. > > Regards, > > Tony Regards, -Bin. -- To unsubscribe from this list: send the line "unsubscribe linux-omap" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
