Re: Does the bonding driver honour dev->features of slave devices

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On Wed, 10 Sep 2003, Tomar, Nagendra wrote:

> Hello All,
> 	  I am going throgh the "Link Aggregation" module in Linux 
> (bonding.c). The code seems to suggest that the dev->features of slave 
> devices is simply ignored while bundling into the master device. Suppose
> I 
> have two Intel epro1000 cards that can support TCP Segmentation Offload.
> 
> Now if I bond these two slave cards into a new master card, the new 
> bonding device that is the master device will be used in the routing 
> table. When a TCP connection is established sk->route_caps is assigned 
> from the dev->features of the assigned outgoing device. If the outgoing 
> device is the bonding device then the dev->features won't have
> NETIF_F_TSO 
> as the feature and hence upper layers will believe that the outgoing 
> device cannot do TSO.
> I believe that at best we can take an OR of the dev->features of all the

Sorry, I mean AND ..

> 
> slave devices and assign it to the dev->features of the bonding device. 
> This way we are sure that we are taking the Least Common Denominator
> while 
> deciding the features for the master device.
> 
> Thanx,
> tomar
> 
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