On 三, 2012-08-01 at 16:35 +0800, Zhang Rui wrote:
> in this case, should I create an incremental patch to fix the problem,
> or should I refresh my patch to cover that?
>
I refreshed the patch to fix the build error. please pull.
thanks,
rui
> 三, 2012-08-01 at 15:36 +0800, Fengguang Wu wrote:
> > Hi Zhang,
> >
> > Kernel build failed on
> >
> > tree: git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux.git thermal
> > head: 77fd40968a98055d5e910461be9a8c7a8be63251
> > commit: 230c4d13a49b0faed79f1273d0f43121fa993ff5 [5/13] Thermal: Remove tc1/tc2 in generic thermal layer.
> > config: x86_64-randconfig-h021 (attached as .config)
> >
> > All related error/warning messages:
> >
> > drivers/power/power_supply_core.c: In function 'psy_register_thermal':
> > drivers/power/power_supply_core.c:204:6: error: too many arguments to function 'thermal_zone_device_register'
> > In file included from drivers/power/power_supply_core.c:20:0:
> > include/linux/thermal.h:163:29: note: declared here
> >
> > vim +204 drivers/power/power_supply_core.c
> > 201 for (i = 0; i < psy->num_properties; i++) {
> > 202 if (psy->properties[i] == POWER_SUPPLY_PROP_TEMP) {
> > 203 psy->tzd = thermal_zone_device_register(psy->name, 0, 0,
> > > 204 psy, &psy_tzd_ops, 0, 0, 0, 0);
> > 205 if (IS_ERR(psy->tzd))
> > 206 return PTR_ERR(psy->tzd);
> > 207 break;
> >
> > ---
> > 0-DAY kernel build testing backend Open Source Technology Centre
> > Fengguang Wu <wfg@xxxxxxxxxxxxxxx> Intel Corporation
>
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