This patch serie adds support for thermal monitoring block on Qualcomm's
PMIC5 chips. PM8150{,b,l} and sm8250-mtp board device trees are extended
to support thermal zones provided by this thermal monitoring block.
Unlike the rest of PMIC thermal senses, these thermal zones describe
particular thermistors, which differ between from board to board.
Changes since v5:
- Reworked DT bindings:
* Removed qcom,adc-channel, instead it is parsed from io-channels
* Renamed qcom,hw-settle-time to include -us suffix
- Re-added monitor enabling which got lost during refactored. Noted by
Jishnu Prakash.
- Use threaded IRQ handler as susggested by Jishnu.
Changes since v4:
- Added kernel-doc comments to ADC-TM structures
- Used several sizeof(buf) instead of hand-conding register size
Changes since v3:
- Fix DT description to spell "thermal monitoring" instead of just TM
- Fix warnings in DT example
- Add EXPORT_SYMBOL_GPL(of_iio_channel_get_by_name)
- Fixed whitespace chanes in qcom-vadc-common.c
- Removed error message if IIO chanel get returns -EPROBE_DEFER
Changes since v2:
- IIO: export of_iio_channel_get_by_name() function
- dt-bindings: move individual io-channels to each thermal monitoring
channel rather than listing them all in device node
- added fallback defaults to of_device_get_match_data calls in
qcom-spmi-adc5 and qcom-spmi-adc-tm5 drivers
- minor typo fixes
Changes since v1:
- Introduce fixp_linear_interpolate() by Craig Tatlor
- Lots of syntax/whitespace changes
- Cleaned up register definitions per Jonathan's suggestion
- Implemented most of the suggestions from Bjorn's and Jonathan's
review
