Re: [patch 00/17] init, treewide, x86: Cleanup check_bugs() and start sanitizing the x86 boot process
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- To: Thomas Gleixner <tglx@xxxxxxxxxxxxx>
- Subject: Re: [patch 00/17] init, treewide, x86: Cleanup check_bugs() and start sanitizing the x86 boot process
- From: Jan Engelhardt <jengelh@xxxxxxx>
- Date: Wed, 28 Jun 2023 05:38:57 +0200 (CEST)
- Cc: LKML <linux-kernel@xxxxxxxxxxxxxxx>, x86@xxxxxxxxxx, Linus Torvalds <torvalds@xxxxxxxxxxxxxxxxxxxx>, Nikolay Borisov <nik.borisov@xxxxxxxx>, "Ahmed S. Darwish" <darwi@xxxxxxxxxxxxx>, Arnd Bergmann <arnd@xxxxxxxx>, Russell King <linux@xxxxxxxxxxxxxxx>, linux-arm-kernel@xxxxxxxxxxxxxxxxxxx, linux-ia64@xxxxxxxxxxxxxxx, Huacai Chen <chenhuacai@xxxxxxxxxx>, WANG Xuerui <kernel@xxxxxxxxxx>, loongarch@xxxxxxxxxxxxxxx, Geert Uytterhoeven <geert@xxxxxxxxxxxxxx>, linux-m68k@xxxxxxxxxxxxxxx, Thomas Bogendoerfer <tsbogend@xxxxxxxxxxxxxxxx>, linux-mips@xxxxxxxxxxxxxxx, Yoshinori Sato <ysato@xxxxxxxxxxxxx>, Rich Felker <dalias@xxxxxxxx>, John Paul Adrian Glaubitz <glaubitz@xxxxxxxxxxxxxxxxxxx>, linux-sh@xxxxxxxxxxxxxxx, "David S. Miller" <davem@xxxxxxxxxxxxx>, sparclinux@xxxxxxxxxxxxxxx, Richard Weinberger <richard@xxxxxx>, Anton Ivanov <anton.ivanov@xxxxxxxxxxxxxxxxxx>, Johannes Berg <johannes@xxxxxxxxxxxxxxxx>, linux-um@xxxxxxxxxxxxxxxxxxx, Richard Henderson <richard.henderson@xxxxxxxxxx>, "James E.J. Bottomley" <James.Bottomley@xxxxxxxxxxxxxxxxxxxxx>, Michael Ellerman <mpe@xxxxxxxxxxxxxx>, Chris Zankel <chris@xxxxxxxxxx>, Tom Lendacky <thomas.lendacky@xxxxxxx>
- In-reply-to: <20230613223827.532680283@linutronix.de>
- References: <20230613223827.532680283@linutronix.de>
- User-agent: Alpine 2.25 (LSU 592 2021-09-18)
On Wednesday 2023-06-14 01:39, Thomas Gleixner wrote:
>Hi!
>
>My team and myself are working on sanitizing the x86 boot process,
>especially the complete horror show of CPUID evaluation, which is
>constructed with hay-wire circuits, duct tape and superglue.
What's with Intel and its glue analogies? Not to mention it stuck very
well, if I may say so myself (not to mention the glue in the co
struction of the 12th Intel series).
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