Re: [PATCH v4] hwmon: max6650: add thermal cooling device capability

[Date Prev][Date Next][Thread Prev][Thread Next][Date Index][Thread Index]

 



On Fri, Apr 19, 2019 at 06:15:20AM -0700, Guenter Roeck wrote:
> On Thu, Apr 18, 2019 at 08:57:22PM -0400, Jean-Francois Dagenais wrote:
> > This allows max6650 devices to be referenced in dts as a cooling device.
> > 
> > The pwm value seems duplicated in cooling_dev_state but since pwm goes
> > through rounding logic into data->dac, it is modified and messes with
> > the thermal zone state algorithms. It's also better to serve a cache
> > value, thus avoiding periodic actual i2c traffic.
> > 
> > Signed-off-by: Jean-Francois Dagenais <jeff.dagenais@xxxxxxxxx>
> 
> Looking into this more closely, I notice that it has a substantial downside:
> It only registers one channel with the thermal subsystem. That is ok for
> max6650, but it is a problem for max6651. There, it only registers a single
> channel. Worse, extending it later would be difficult since the single-channel
> support implies that the thermal data in the dts file would (probably) have to
> look completely different for multi-channel support.
> 
> How does your proposed dts file look like ? Can we possibly adjust it to work
> with multiple channels (ie with all channels of max6651) ?
> 
Never mind, I am talking nonsense. The max6651 has 4 tachometer input channels,
but only one pwm channel. Sorry for the noise. I'll apply your patch.

Can you send me a register dump for the chip (from i2cdump) ? 

Thanks,
Guenter



[Index of Archives]     [LM Sensors]     [Linux Sound]     [ALSA Users]     [ALSA Devel]     [Linux Audio Users]     [Linux Media]     [Kernel]     [Gimp]     [Yosemite News]     [Linux Media]

  Powered by Linux