Re: [PATCH v5 2/4] dt-bindings: document Rockchip thermal

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Tomeu,

在 2014年09月18日 17:27, Tomeu Vizoso 写道:
On 17 September 2014 05:59, Caesar Wang <caesar.wang@xxxxxxxxxxxxxx> wrote:
This add the necessary binding documentation for the thermal
found on Rockchip SoCs
Hi Caesar,

is there any reason to not use the existing thermal bindings? You can
find a description in
Documentation/devicetree/bindings/thermal/thermal.txt and example code
in omap, or in the patches for Tegra recently posted by Mikko
Perttunen.

Regards,

Tomeu

Why should I use the existing thermal bindings?
I believe omap,tegar and rockchip are  the three seperate thermals driver.

So far, I submitted the series Patchs for rockchip thermal.

Signed-off-by: zhaoyifeng <zyf@xxxxxxxxxxxxxx>
Signed-off-by: Caesar Wang <caesar.wang@xxxxxxxxxxxxxx>
---
  .../bindings/thermal/rockchip-thermal.txt          | 41 ++++++++++++++++++++++
  1 file changed, 41 insertions(+)
  create mode 100644 Documentation/devicetree/bindings/thermal/rockchip-thermal.txt

diff --git a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
new file mode 100644
index 0000000..6fc8bc3
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
@@ -0,0 +1,41 @@
+* Temperature Sensor ADC (TSADC) on rockchip SoCs
+
+Required properties:
+- compatible: "rockchip,rk3288-tsadc"
+- reg: physical base address of the controller and length of memory mapped
+       region.
+- interrupts: The interrupt number to the cpu. The interrupt specifier format
+             depends on the interrupt controller.
+- clocks: Must contain an entry for each entry in clock-names.
+- clock-names: Shall be "tsadc" for the converter-clock, and "apb_pclk" for
+              the peripheral clock.
+- num-trips:  number of total trip points, this is required, set it 0 if none,
+             if greater than 0, the following properties must be defined;
+- tripN-temp: temperature of trip point N, should be in ascending order;
+- tripN-type: type of trip point N, should be one of "active" "passive" "hot"
+             "critical";
+- tripN-cdev-num: number of the cooling devices which can be bound to trip
+                 point N, this is required if trip point N is defined, set it 0 if none,
+                 otherwise the following cooling device names must be defined;
+- tripN-cdev-nameM: name of the No. M cooling device of trip point N;
+
+Example:
+tsadc: tsadc@ff280000 {
+       compatible = "rockchip,rk3288-tsadc";
+       reg = <0xff280000 0x100>;
+       interrupts = <GIC_SPI 37 IRQ_TYPE_LEVEL_HIGH>;
+       clocks = <&cru SCLK_TSADC>, <&cru PCLK_TSADC>;
+       clock-names = "tsadc", "apb_pclk";
+
+       num-trips = <2>;
+
+       trip0-temp = <80>;
+       trip0-type = "passive";
+       trip0-cdev-num = <1>;
+       trip0-cdev-name0 = "thermal-cpufreq-0";
+
+       trip1-temp = <100>;
+       trip1-type = "critical";
+       trip1-cdev-num = <1>;
+       trip1-cdev-name0 = "thermal-cpufreq-0";
+};
--
1.9.1


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--
Best regards,
Caesar


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