Re: [PATCH v4 1/2] dt-bindings: hwmon: ti,ina2xx: Add INA233 device

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On Thu, Jan 16, 2025 at 04:59:40PM +0800, Leo Yang wrote:
> Add TI INA233 Current and Power Monitor bindings.
> 
> Signed-off-by: Leo Yang <leo.yang.sy0@xxxxxxxxx>
> ---
>  .../devicetree/bindings/hwmon/ti,ina2xx.yaml  | 30 +++++++++++++++++++
>  1 file changed, 30 insertions(+)
> 
> diff --git a/Documentation/devicetree/bindings/hwmon/ti,ina2xx.yaml b/Documentation/devicetree/bindings/hwmon/ti,ina2xx.yaml
> index 05a9cb36cd82..7372e282765b 100644
> --- a/Documentation/devicetree/bindings/hwmon/ti,ina2xx.yaml
> +++ b/Documentation/devicetree/bindings/hwmon/ti,ina2xx.yaml
> @@ -27,6 +27,7 @@ properties:
>        - ti,ina226
>        - ti,ina230
>        - ti,ina231
> +      - ti,ina233
>        - ti,ina237
>        - ti,ina238
>        - ti,ina260
> @@ -75,12 +76,41 @@ properties:
>        the alert polarity to active-high.
>      $ref: /schemas/types.yaml#/definitions/flag
>  
> +  ti,maximum-expected-current-microamp:
> +    description: |
> +      This value indicates the maximum current in microamps that you can
> +      expect to measure with ina233 in your circuit.
> +
> +      This value will be used to calculate the Current_LSB and current/power
> +      coefficient for the pmbus and to calibrate the IC.
> +    minimum: 32768
> +    maximum: 4294967295

Uh, are these real values measurable by the device? The last one looks
like UINT_MAX.

> +    default: 32768000

Default is 32 A? For what applications is this sensor used?

Best regards,
Krzysztof





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