[PATCH V3 0/3] Add DT bindings and device tree nodes for TSENS in SC7280

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Adding compatible string in TSENS dt-bindings, device node for TSENS controller and 
critical interrupt support, Thermal zone, cooling maps support and changing Hysteresis 
value for critical trip point, adding cooling-cells property.

Changes:
1) Adding sensors according to sensor index rules under thermal-zones.
2) Changing Hysteresis, as it is not needed for critical trip point, when it reaches 
   critical threshold system will go for shutdown.
3) Adding cooling-cells property under cpus node.

Dependencies:
https://lore.kernel.org/patchwork/project/lkml/list/?series=487403
https://lore.kernel.org/patchwork/patch/1410952/

Rajeshwari (3):
  dt-bindings: thermal: tsens: Add compatible string to TSENS binding
    for SC7280
  arm64: dts: qcom: SC7280:  Add device node support for TSENS
  arm64: dts: qcom: SC7280: Add thermal zone support

 .../devicetree/bindings/thermal/qcom-tsens.yaml    |   1 +
 arch/arm64/boot/dts/qcom/sc7280.dtsi               | 874 +++++++++++++++++++++
 2 files changed, 875 insertions(+)

-- 
QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member 
of Code Aurora Forum, hosted by The Linux Foundation




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