[RESEND PATCH V3 5/5] arm64: dts: qcom: sc7280: Include PMIC DT files for sc7280

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Include pm7325, pm8350c, pmk8350 and pmr735a DT files. Add
channel nodes for pmk8350_vadc. Also, add the thermal_zones
node in dtsi.

Signed-off-by: satya priya <skakit@xxxxxxxxxxxxxx>
---
 arch/arm64/boot/dts/qcom/sc7280-idp.dts | 30 ++++++++++++++++++++++++++++++
 arch/arm64/boot/dts/qcom/sc7280.dtsi    |  3 +++
 2 files changed, 33 insertions(+)

diff --git a/arch/arm64/boot/dts/qcom/sc7280-idp.dts b/arch/arm64/boot/dts/qcom/sc7280-idp.dts
index 950ecb2..9293502 100644
--- a/arch/arm64/boot/dts/qcom/sc7280-idp.dts
+++ b/arch/arm64/boot/dts/qcom/sc7280-idp.dts
@@ -8,6 +8,10 @@
 /dts-v1/;
 
 #include "sc7280.dtsi"
+#include "pm7325.dtsi"
+#include "pm8350c.dtsi"
+#include "pmk8350.dtsi"
+#include "pmr735a.dtsi"
 
 / {
 	model = "Qualcomm Technologies, Inc. sc7280 IDP platform";
@@ -22,6 +26,32 @@
 	};
 };
 
+&pmk8350_vadc {
+		pm8350_die_temp {
+			reg = <PM8350_ADC7_DIE_TEMP>;
+			label = "pm8350_die_temp";
+			qcom,pre-scaling = <1 1>;
+		};
+
+		pmk8350_die_temp {
+			reg = <PMK8350_ADC7_DIE_TEMP>;
+			label = "pmk8350_die_temp";
+			qcom,pre-scaling = <1 1>;
+		};
+
+		pmr735a_die_temp {
+			reg = <PMR735A_ADC7_DIE_TEMP>;
+			label = "pmr735a_die_temp";
+			qcom,pre-scaling = <1 1>;
+		};
+
+		pmr735b_die_temp {
+			reg = <PMR735B_ADC7_DIE_TEMP>;
+			label = "pmr735b_die_temp";
+			qcom,pre-scaling = <1 1>;
+		};
+};
+
 &qupv3_id_0 {
 	status = "okay";
 };
diff --git a/arch/arm64/boot/dts/qcom/sc7280.dtsi b/arch/arm64/boot/dts/qcom/sc7280.dtsi
index 39cf0be..0f4fd33 100644
--- a/arch/arm64/boot/dts/qcom/sc7280.dtsi
+++ b/arch/arm64/boot/dts/qcom/sc7280.dtsi
@@ -605,4 +605,7 @@
 			     <GIC_PPI 11 IRQ_TYPE_LEVEL_LOW>,
 			     <GIC_PPI 10 IRQ_TYPE_LEVEL_LOW>;
 	};
+
+	thermal_zones: thermal-zones {
+	};
 };
-- 
QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member 
of Code Aurora Forum, hosted by The Linux Foundation




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