On Thu, 10 Sep 2020 16:59:50 +0300
Dmitry Baryshkov <dmitry.baryshkov@xxxxxxxxxx> wrote:
> This patch serie adds support for thermal monitoring block on Qualcomm's
> PMIC5 chips. PM8150{,b,l} and sm8250-mtp board device trees are extended
> to support thermal zones provided by this thermal monitoring block.
> Unlike the rest of PMIC thermal senses, these thermal zones describe
> particular thermistors, which differ between from board to board.
>
As far as I am concerned this series is now ready to go up to one or two
things in patch 8. So on to the normal question based on the assumption
it will pick up other necessary reviews shortly...
What route do we want this to take?
I can do an immutable branch in IIO if that works for patches 1-8 and assume
the dt file changes will got via usual SoC path? We are getting a fair way
into this cycle, so this may well end up happening next cycle depending
on how quick reviews come in.
Thanks,
Jonathan
> Changes since v3:
> - Fix DT description to spell "thermal monitoring" instead of just TM
> - Fix warnings in DT example
> - Add EXPORT_SYMBOL_GPL(of_iio_channel_get_by_name)
> - Fixed whitespace chanes in qcom-vadc-common.c
> - Removed error message if IIO chanel get returns -EPROBE_DEFER
>
> Changes since v2:
> - IIO: export of_iio_channel_get_by_name() function
> - dt-bindings: move individual io-channels to each thermal monitoring
> channel rather than listing them all in device node
> - added fallback defaults to of_device_get_match_data calls in
> qcom-spmi-adc5 and qcom-spmi-adc-tm5 drivers
> - minor typo fixes
>
> Changes since v1:
> - Introduce fixp_linear_interpolate() by Craig Tatlor
> - Lots of syntax/whitespace changes
> - Cleaned up register definitions per Jonathan's suggestion
> - Implemented most of the suggestions from Bjorn's and Jonathan's
> review
>
>
>
