On Sun, 21 Jun 2020 22:35:45 +0300, Dmitry Baryshkov wrote: > Add bindings for thermal monitor, part of Qualcomm PMIC5 chips. It is a > close counterpart of VADC part of those PMICs. > > Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@xxxxxxxxxx> > --- > .../bindings/thermal/qcom-spmi-adc-tm5.yaml | 143 ++++++++++++++++++ > 1 file changed, 143 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml > My bot found errors running 'make dt_binding_check' on your patch: Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml: while scanning a block scalar in "<unicode string>", line 114, column 5 found a tab character where an indentation space is expected in "<unicode string>", line 115, column 1 Documentation/devicetree/bindings/Makefile:20: recipe for target 'Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.example.dts' failed make[1]: *** [Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.example.dts] Error 1 make[1]: *** Waiting for unfinished jobs.... Makefile:1347: recipe for target 'dt_binding_check' failed make: *** [dt_binding_check] Error 2 See https://patchwork.ozlabs.org/patch/1313977 If you already ran 'make dt_binding_check' and didn't see the above error(s), then make sure dt-schema is up to date: pip3 install git+https://github.com/devicetree-org/dt-schema.git@master --upgrade Please check and re-submit.
