On 11/20/2019 07:56 AM, Thara Gopinath wrote: > Certain resources modeled as a generic power domain in linux kernel can be > used to warm up the SoC (mx power domain on sdm845) if the temperature > falls below certain threshold. These power domains can be considered as > thermal warming devices. (opposite of thermal cooling devices). > > In kernel, these warming devices can be modeled as a thermal cooling > device. Since linux kernel today has no instance of a resource modeled as > a power domain acting as a thermal warming device, a generic power domain > based thermal warming device driver that can be used pan-Socs is the > approach taken in this patch series. Since thermal warming devices can be > thought of as the mirror opposite of thermal cooling devices, this patch > series re-uses thermal cooling device framework. To use these power > domains as warming devices require further tweaks in the thermal framework > which are out of scope of this patch series. These tweaks have been posted > as a separate series[1]. Hi, Can this series be merged ? It has been acked from DT and genpd point of view. Warm Regards Thara
