Hi Amit, On Fri, Jul 26, 2019 at 03:48:35AM +0530, Amit Kucheria wrote: > Add interrupt support to TSENS. The first 6 patches are general fixes and > cleanups to the driver before interrupt support is introduced. > > This series has been developed against qcs404 and sdm845 and then tested on > msm8916. Testing on msm8998 and msm8974 would be appreciated since I don't > have hardware handy. Further, I plan to test on msm8996 and also submit to > kernelci. > > I'm sending this out for more review to get help with testing. I can test this on msm8974 for you using a Nexus 5. Here's what I've done so far: The device tree nodes appear in sysfs: / # ls -1 /sys/class/thermal/ cooling_device0 cooling_device1 thermal_zone0 thermal_zone1 thermal_zone2 thermal_zone3 thermal_zone4 thermal_zone5 thermal_zone6 thermal_zone7 thermal_zone8 thermal_zone9 The various temperatures were in the upper 40s and I threw some work at all four CPU cores to warm up the phone and watched the various temperatures rise: / # for i in $(seq 0 9) ; do > TYPE=$(cat /sys/class/thermal/thermal_zone$i/type) > TEMP=$(cat /sys/class/thermal/thermal_zone$i/temp) > echo "$TYPE = $TEMP" > done cpu-thermal0 = 66000 cpu-thermal1 = 66000 cpu-thermal2 = 66000 cpu-thermal3 = 66000 q6-dsp-thermal = 60000 modemtx-thermal = 57000 video-thermal = 61000 wlan-thermal = 65000 gpu-thermal-top = 61000 gpu-thermal-bottom = 59000 To test the interrupt support, I lowered all of the temperature trips to 51C but I'm not sure where to read that notification. I assume one of the cooling devices or a governor should be started? Sorry but I haven't done any work in the thermal subsystem yet and I'm short on time this morning to investigate right now. Brian
