Current set of patches apply on 4.6-rc3. nvmem apis are currently broken and hence need to pull in the fixes for it as proposed here [1] Changes since v4: * dropped qcom,tsens-slopes binding, used coefficients instead * dropped qcom,sensor-id binding * Added support for msm8996 family * Other minor review fixes from v4 Changes since v3: * Dropped 'clk: qcom: create virtual child device for TSENS' which is picked up by Stephen * Updated GCC bindings with optional TSENS properties Changes since v2: * Minor review fixes from Stephen/Punit and rebase on 4.3-rc4 Changes since v1: * Created virtual tsens device from gcc driver for 8960, with DT having a single node for gcc and tsens * Minor fixes with rebasing on 4.3-rc1 Changes since RFC: * Added support for 8916 and 8084 * Based off the latest nvmem framework patches [1] * Minor review fixes for comments mostly from Lina This is an attempt to have a single TSENS driver for the different versions of the TSENS IP that exist, on different qcom msm/apq SoCs' Support is added for msm8916, msm8960, msm8974 and msm8996 families. A lot of the work is based of original code from Stephen Boyd and Siddartha Mohanadoss. I have also picked some of what Narendran Rajan did in his attempt to upstream the support for 8960 family. I could not keep the original authorship on any of the patches because I ended up moving the code around quite a bit in an effort to have a single driver for the various devices. I would be glad to change the authorship for any of the patches if needed. [1] https://lkml.org/lkml/2016/4/13/654 Rajendra Nayak (11): thermal: qcom: tsens: Add a skeletal TSENS drivers thermal: qcom: tsens-8916: Add support for 8916 family of SoCs thermal: qcom: tsens-8974: Add support for 8974 family of SoCs thermal: core: export apis to get slope and offset thermal: qcom: tsens-8960: Add support for 8960 family of SoCs thermal: qcom: tsens-8996: Add support for 8996 family of SoCs arm: dts: msm8974: Add thermal zones, tsens and qfprom nodes arm: dts: apq8064: Add thermal zones, tsens and qfprom nodes arm: dts: apq8084: Add thermal zones, tsens and qfprom nodes arm64: dts: msm8916: Add thermal zones, tsens and qfprom nodes arm64: dts: msm8996: Add thermal zones, tsens and qfprom nodes .../devicetree/bindings/clock/qcom,gcc.txt | 18 ++ .../devicetree/bindings/thermal/qcom-tsens.txt | 21 ++ arch/arm/boot/dts/qcom-apq8064.dtsi | 103 ++++++++ arch/arm/boot/dts/qcom-apq8084.dtsi | 103 ++++++++ arch/arm/boot/dts/qcom-msm8974.dtsi | 103 ++++++++ arch/arm64/boot/dts/qcom/msm8916.dtsi | 64 +++++ arch/arm64/boot/dts/qcom/msm8996.dtsi | 92 +++++++ drivers/thermal/Kconfig | 5 + drivers/thermal/Makefile | 1 + drivers/thermal/qcom/Kconfig | 11 + drivers/thermal/qcom/Makefile | 2 + drivers/thermal/qcom/tsens-8916.c | 113 ++++++++ drivers/thermal/qcom/tsens-8960.c | 293 +++++++++++++++++++++ drivers/thermal/qcom/tsens-8974.c | 244 +++++++++++++++++ drivers/thermal/qcom/tsens-8996.c | 82 ++++++ drivers/thermal/qcom/tsens-common.c | 135 ++++++++++ drivers/thermal/qcom/tsens.c | 207 +++++++++++++++ drivers/thermal/qcom/tsens.h | 92 +++++++ drivers/thermal/thermal_core.c | 16 ++ include/linux/thermal.h | 8 + 20 files changed, 1713 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/qcom-tsens.txt create mode 100644 drivers/thermal/qcom/Kconfig create mode 100644 drivers/thermal/qcom/Makefile create mode 100644 drivers/thermal/qcom/tsens-8916.c create mode 100644 drivers/thermal/qcom/tsens-8960.c create mode 100644 drivers/thermal/qcom/tsens-8974.c create mode 100644 drivers/thermal/qcom/tsens-8996.c create mode 100644 drivers/thermal/qcom/tsens-common.c create mode 100644 drivers/thermal/qcom/tsens.c create mode 100644 drivers/thermal/qcom/tsens.h -- QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation -- To unsubscribe from this list: send the line "unsubscribe linux-arm-msm" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
