Re: [PATCH 0/4] thermal: Introduce Qualcomm Thermal Mitigation Device support

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On Sun, Oct 01, 2023 at 09:27:01PM +0530, Manivannan Sadhasivam wrote:
> On Fri, Sep 29, 2023 at 05:16:16PM +0100, Caleb Connolly wrote:
> > The Thermal Mitigation Device (TMD) Service is a QMI service that runs
> > on remote subsystems (the modem and DSPs) on Qualcomm SoCs.
> > It exposes various mitigations including passive thermal controls and
> > rail voltage restrictions.
> > 
> > This series introduces support for exposing TMDs as cooling devices
> > in the kernel through the thermal framework, using the QMI interface.
> > 
> > Each TMD client is described as a child of the remoteproc node in
> > devicetree. With subnodes for each control.
> > 
> 
> Daniel expressed concerns in the past aganist representing TMD driver as a
> cooling device since it is not tied to thermal zones and the governors cannot
> use it. Instead he suggested to represent it as a powercap device with thermal
> constraints.
> 
> So please look into that approach.
> 

The powercap framework revolves around the idea that we have some amount
of power (micro-watt) being available to the system, which can be split
across a range of devices.

Say that we implement this as a powercap thing, what current consumption
would you attribute these entires? How would you map a given uW value to
the mitigation levels provided by the qmi-cooling instances?


Beyond that, I'm still not sure how we would plug this in. We don't have
a picture of the power consumption/flow through the system at any point
in time - as the control of the power grid is distributed across the
various subsystems.

Regards,
Bjorn



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