Re: [PATCH v2 02/26] dt-bindings: soc: qcom: merge qcom,saw2.txt into qcom,spm.yaml

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On Sun, Jun 25, 2023 at 11:25:23PM +0300, Dmitry Baryshkov wrote:
> The Qualcomm SPM / SAW2 device is described in two bindigns files:

bindings

> arm/msm/qcom,saw2.txt and soc/qcom/qcom,spm.yaml. Merge the former into
> the latter, adding detailed device node description. While we are at it,
> also rename qcom,spm.yaml to qcom,saw2.yaml to follow the actual
> compatible used for these devices.
> 
> The regulator property is retained as is. It will be changed in the
> later patches.
> 
> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@xxxxxxxxxx>
> ---
>  .../devicetree/bindings/arm/msm/qcom,saw2.txt | 58 -------------------
>  .../qcom/{qcom,spm.yaml => qcom,saw2.yaml}    | 26 +++++++--
>  2 files changed, 20 insertions(+), 64 deletions(-)
>  delete mode 100644 Documentation/devicetree/bindings/arm/msm/qcom,saw2.txt
>  rename Documentation/devicetree/bindings/soc/qcom/{qcom,spm.yaml => qcom,saw2.yaml} (64%)

Reviewed-by: Rob Herring <robh@xxxxxxxxxx>



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