Re: [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226

[Date Prev][Date Next][Thread Prev][Thread Next][Date Index][Thread Index]

 



On Sonntag, 7. Mai 2023 22:12:20 CEST Matti Lehtimäki wrote:
> Qualcomm MSM8226 has tsens v0.1 block.
> 
> Signed-off-by: Matti Lehtimäki <matti.lehtimaki@xxxxxxxxx>

Reviewed-by: Luca Weiss <luca@xxxxxxxxx>

> ---
>  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
>  1 file changed, 1 insertion(+)
> 
> diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml index
> 926e9c51c93c..d6b2957d5137 100644
> --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> @@ -29,6 +29,7 @@ properties:
>          items:
>            - enum:
>                - qcom,mdm9607-tsens
> +              - qcom,msm8226-tsens
>                - qcom,msm8916-tsens
>                - qcom,msm8939-tsens
>                - qcom,msm8974-tsens








[Index of Archives]     [Linux ARM Kernel]     [Linux ARM]     [Linux Omap]     [Fedora ARM]     [Linux for Sparc]     [IETF Annouce]     [Security]     [Bugtraq]     [Linux MIPS]     [ECOS]     [Asterisk Internet PBX]     [Linux API]

  Powered by Linux