On Wed, May 03, 2023 at 08:34:45AM +0200, Krzysztof Kozlowski wrote: > On 03/05/2023 06:45, Varadarajan Narayanan wrote: > > From: Praveenkumar I <quic_ipkumar@xxxxxxxxxxx> > > > > Qualcomm IPQ9574 has tsens v2.3.1 block, which is similar to IPQ8074 tsens. > > > > Signed-off-by: Praveenkumar I <quic_ipkumar@xxxxxxxxxxx> > > Signed-off-by: Varadarajan Narayanan <quic_varada@xxxxxxxxxxx> > > --- > > Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 3 +++ > > 1 file changed, 3 insertions(+) > > > > I saw already v1, so this looks like v2, not v1. Please add changelog > describing what you changed here. No code change between v1 and v2 w.r.t this patch. The 4th patch alone in this series has code changes between v1 and v2. > > diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml > > index d1ec963..8e2208c 100644 > > --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml > > +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml > > @@ -66,6 +66,7 @@ properties: > > - description: v2 of TSENS with combined interrupt > > enum: > > - qcom,ipq8074-tsens > > + - qcom,ipq9574-tsens > > This is a friendly reminder during the review process. > > It seems my previous comments were not fully addressed. Maybe my > feedback got lost between the quotes, maybe you just forgot to apply it. > Please go back to the previous discussion and either implement all > requested changes or keep discussing them. > > Thank you. Sorry. Looks like I missed https://lore.kernel.org/lkml/20230502080611.GB26126@xxxxxxxxxxxxxxxxxxxxxxxx/T/#m42a9b77be2ceddf1adc90c07f487929fcf2dbc0f Will take that input and post a new version. Thanks Varada > Best regards, > Krzysztof >
