Make the MDM9607 thermal sensor support consistent with Qualcomm's vendor kernel (msm-3.18) by applying the correct default slope values and adding "correction factors" to the factory calibration values in the fuses. Use the same functionality to add the very similar MSM8909 SoC to the tsens driver. --- Changes in v2: - Rewrite on top of per-sensor nvmem cell changes that landed in 6.3 - Add patches to fix existing support for MDM9607 Stephan Gerhold (6): thermal: qcom: tsens: Drop unused legacy structs thermal: qcom: tsens-v0_1: Fix mdm9607 slope values thermal: qcom: tsens-v0_1: Add mdm9607 correction offsets dt-bindings: thermal: qcom-tsens: Drop redundant compatibles dt-bindings: thermal: qcom-tsens: Add MSM8909 compatible thermal: qcom: tsens-v0_1: Add MSM8909 data .../bindings/thermal/qcom-tsens.yaml | 23 +---- drivers/thermal/qcom/tsens-v0_1.c | 97 +++++++++++-------- drivers/thermal/qcom/tsens-v1.c | 22 ----- drivers/thermal/qcom/tsens.c | 19 +++- drivers/thermal/qcom/tsens.h | 6 +- 5 files changed, 84 insertions(+), 83 deletions(-) -- 2.30.2
