Re: [PATCH 02/12] dt-bindings: thermal: tsens: Add SM6115 compatible

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To: Adam Skladowski <a39.skl@xxxxxxxxx>
Subject: Re: [PATCH 02/12] dt-bindings: thermal: tsens: Add SM6115 compatible
From: Krzysztof Kozlowski <krzysztof.kozlowski@xxxxxxxxxx>
Date: Wed, 30 Nov 2022 16:08:37 +0100
Cc: phone-devel@xxxxxxxxxxxxxxx, ~postmarketos/upstreaming@xxxxxxxxxxx, Rob Clark <robdclark@xxxxxxxxx>, Abhinav Kumar <quic_abhinavk@xxxxxxxxxxx>, Dmitry Baryshkov <dmitry.baryshkov@xxxxxxxxxx>, Sean Paul <sean@xxxxxxxxxx>, David Airlie <airlied@xxxxxxxxx>, Daniel Vetter <daniel@xxxxxxxx>, Rob Herring <robh+dt@xxxxxxxxxx>, Krzysztof Kozlowski <krzysztof.kozlowski+dt@xxxxxxxxxx>, Andy Gross <agross@xxxxxxxxxx>, Bjorn Andersson <andersson@xxxxxxxxxx>, Konrad Dybcio <konrad.dybcio@xxxxxxxxxx>, Amit Kucheria <amitk@xxxxxxxxxx>, Thara Gopinath <thara.gopinath@xxxxxxxxx>, "Rafael J. Wysocki" <rafael@xxxxxxxxxx>, Daniel Lezcano <daniel.lezcano@xxxxxxxxxx>, Zhang Rui <rui.zhang@xxxxxxxxx>, Loic Poulain <loic.poulain@xxxxxxxxxx>, linux-arm-msm@xxxxxxxxxxxxxxx, dri-devel@xxxxxxxxxxxxxxxxxxxxx, freedreno@xxxxxxxxxxxxxxxxxxxxx, devicetree@xxxxxxxxxxxxxxx, linux-kernel@xxxxxxxxxxxxxxx, linux-pm@xxxxxxxxxxxxxxx
In-reply-to: <20221129204616.47006-3-a39.skl@gmail.com>
References: <20221129204616.47006-1-a39.skl@gmail.com> <20221129204616.47006-3-a39.skl@gmail.com>
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On 29/11/2022 21:46, Adam Skladowski wrote:
> Document compatible for tsens on Qualcomm SM6115 platform
> according to downstream dts it ship v2.4 of IP
> 
> Signed-off-by: Adam Skladowski <a39.skl@xxxxxxxxx>



Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@xxxxxxxxxx>

Best regards,
Krzysztof

References:
- [PATCH 00/12] SM6115 DTS changes
  - From: Adam Skladowski
- [PATCH 02/12] dt-bindings: thermal: tsens: Add SM6115 compatible
  - From: Adam Skladowski

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