Re: [PATCH 02/12] dt-bindings: thermal: tsens: Add SM6115 compatible

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On 29/11/2022 21:46, Adam Skladowski wrote:
> Document compatible for tsens on Qualcomm SM6115 platform
> according to downstream dts it ship v2.4 of IP
> 
> Signed-off-by: Adam Skladowski <a39.skl@xxxxxxxxx>



Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@xxxxxxxxxx>

Best regards,
Krzysztof




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